GE Industrial Solutions KW010-015-020-025 (Sixteenth-Brick) - Manual (Page 16)

Data Sheet
October 7, 2013
KW010/015/020/025 Series Power Modules:
36 – 75Vdc Input; 1.2 to 5.0Vdc Output; 10 to 25A Output current
LINEAGE POWER 16
Surface Mount Information
Pick and Place
The KW010-025 modules use an open frame
construction and are designed for a fully automated
assembly process. The pick and place location on
the module is the larger magnetic core as shown in
Figure 46. The modules are fitted with a label which
meets all the requirements for surface mount
processing, as well as safety standards, and is able to
withstand reflow temperatures of up to 300
o
C. The
label also carries product information such as product
code, serial number and the location of manufacture.
Figure 46. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The recommended nozzle diameter for reliable
operation is 6mm. Oblong or oval nozzles up to 11 x 6
mm may also be used within the space available.
Tin Lead Soldering
The KW010-025 power modules (both non-Z and –Z
codes) can be soldered either in a conventional
Tin/Lead (Sn/Pb) process. The non-Z version of the
KW010-025 modules are RoHS compliant with the
lead exception. Lead based solder paste is used in
the soldering process during the manufacturing of
these modules. These modules can only be soldered
in conventional Tin/lead (Sn/Pb) process. It is
recommended that the customer review data sheets
in order to customize the solder reflow profile for each
application board assembly. The following
instructions must be observed when soldering these
units. Failure to observe these instructions may result
in the failure of or cause damage to the modules, and
can adversely affect long-term reliability.
In a conventional Tin/Lead (Sn/Pb) solder process
peak reflow temperatures are limited to less than
235
o
C. Typically, the eutectic solder melts at 183
o
C,
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For
reliable soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
RE
F
L
O
W
T
E
M
P
(
 C)
REFLOW TIME (S)
Figure 47. Reflow Profile for Tin/Lead (Sn/Pb)
process
M
A
X
T
E
M
P
S
O
L
DE
R (
 C)
Figure 48. Time Limit Curve Above 205
o
C for
Tin/Lead (Sn/Pb) process