GE Industrial Solutions 20A Analog MicroDLynx - Manual (Page 17)

GE
Data Sheet
20A Analog MicroDLynx TM : Non-Isolated DC-DC Power Modules
3Vdc –14.4Vdc input; 0.45Vdc to 5.5Vdc output; 20A Output Current
April 24, 2013 ©2012 General Electric Company. All rights reserved. Page 17
Thermal Considerations
Power modules operate in a variety of thermal environments;
however, sufficient cooling should always be provided to help
ensure reliable operation.
Considerations include ambient temperature, airflow, module
power dissipation, and the need for increased reliability. A
reduction in the operating temperature of the module will
result in an increase in reliability. The thermal data presented
here is based on physical measurements taken in a wind
tunnel. The test set-up is shown in Figure 48. The preferred
airflow direction for the module is in Figure 49.
Air
flow
x
Power Module
Wind Tunnel
PWBs
12.7_
(0.50)
76.2_
(3.0)
Probe Location
for measuring
airflow and
ambient
temperature
25.4_
(1.0)
Figure 48. Thermal Test Setup.
The thermal reference points, T
ref
used in the specifications
are also shown in Figure 49. For reliable operation the
temperatures at these points should not exceed 130
o C. The
output power of the module should not exceed the rated
power of the module (Vo,set x Io,max).
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board-Mounted
Power Modules” for a detailed discussion of thermal
aspects including maximum device temperatures.
Figure 49. Preferred airflow direction and location of hot-
spot of the module (Tref).