GE Industrial Solutions SHHN000A3 HAMMERHEAD Series - Manual (Page 11)

GE
Datasheet
SHHN000A3 Series; DC-DC Converter Power Modules
9Vdc – 36Vdc input; +15V, -15V Dual Output, 0.3A 9W Output
December 6, 2013
©2013 General Electric Corporation.
All rights reserved.
Page 11
MAX TEM
P
SO
LD
ER (
°C)
TIME LIMIT (S)
Figure 21. Time Limit, T
lim
, Curve Above 205 o C Reflow .
Lead Free Soldering
The –Z version SMT modules of the SHHN000A3 series are
lead-free (Pb-free) and RoHS compliant and are compatible in
a
Pb-free soldering process. Failure to observe the instructions
below may result in the failure of or cause damage to the
modules and can adversely affect long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. D
(Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices)
for both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended forced-
air-convection reflow profile based on the volume and
thickness of the package (table 4-2). The suggested Pb-free
solder paste is Sn/Ag/Cu (SAC). The recommended linear reflow
profile using Sn/Ag/Cu solder is shown in Figure 22.
Surface Mount Information (continued)
Figure 22. Recommended linear reflow profile using
Sn/Ag/Cu solder.
MSL Rating
The SHHN000A3 series SMT modules have a MSL rating of 2a.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount packages is
detailed in J-STD-033 Rev. A (Handling, Packing, Shipping and
Use of Moisture/Reflow Sensitive Surface Mount Devices).
Moisture barrier bags (MBB) with desiccant are required for
MSL ratings of 2 or greater. These sealed packages should not
be broken until time of use. Once the original package is
broken, the floor life of the product at conditions of
≤ 30°C and
60% relative humidity varies according to the MSL rating (see
J-STD-033A). The shelf life for dry packed SMT packages will be
a minimum of 12 months from the bag seal date, when stored
at the following conditions: < 40° C, < 90% relative humidity.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board assembly
process prior to electrical board testing. The result of
inadequate cleaning and drying can affect both the reliability
of a power module and the testability of the finished
circuit-board assembly. For guidance on appropriate soldering,
cleaning and drying procedures, refer to GE Board Mounted
Power Modules: Soldering and Cleaning Application Note
(AP01-056EPS).
200
205
210
215
220
225
230
235
240
0 10 20 30 40 50 60
Per J-STD-020 Rev. D
0
50
100
150
200
250
300
Reflow Time (Seconds)
Ref
lo
w
T
em
p (°
C)
Heating Zone
1°C/Second
Peak Temp 260°C
* Min. Time Above 235°C
15 Seconds
*Time Above 217°C
60 Seconds
Cooling
Zone