GE Industrial Solutions SW-SC001-003 Series - Manual (Page 18)

GE Data Sheet
SW/SC001/003 Series DC-DC Power Module
18-36Vdc & 36-75Vdc Input; 3.3-15Vdc Output; 1-3.5A Output Current
October 14, 2013 ©2013 General Electric Company. All rights reserved. Page 18
Figure 56. Recommended linear reflow profile using
Sn/Ag/Cu solder.
MSL Rating
The SW/SC series SMT modules have a MSL rating of 2A.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount packages is
detailed in J-STD-033 Rev. A (Handling, Packing, Shipping and
Use of Moisture/Reflow Sensitive Surface Mount Devices).
Moisture barrier bags (MBB) with desiccant are required for
MSL ratings of 2 or greater. These sealed packages should not
be broken until time of use. Once the original package is
broken, the floor life of the product at conditions of
 30°C and
60% relative humidity varies according to the MSL rating (see
J-STD-033A). The shelf life for dry packed SMT packages will be
a minimum of 12 months from the bag seal date, when stored
at the following conditions: < 40° C, < 90% relative humidity.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board assembly
process prior to electrical board testing. The result of
inadequate cleaning and drying can affect both the reliability
of a power module and the testability of the finished
circuit-board assembly. For guidance on appropriate soldering,
cleaning and drying procedures, refer to Lineage Power Board
Mounted Power Modules: Soldering and Cleaning Application
Note (AN04-001).