GE Industrial Solutions SW-SC001-003 Series - Manual (Page 16)

GE Data Sheet
SW/SC001/003 Series DC-DC Power Module
18-36Vdc & 36-75Vdc Input; 3.3-15Vdc Output; 1-3.5A Output Current
October 14, 2013 ©2013 General Electric Company. All rights reserved. Page 16
VI(+)
SW003A0A
VI(-)
Vo +
Vo -
Pulse P0354
CMC 1.17mH
L1 10uH
C6 2 x 56nF
C5 N/F
C4
4.7uF
Polymer
C1
0.68uF
C2
0.68uF
5V @ 3A C3
0.68uF
Figure 50. Suggested Configuration for EN55022 Class B.
100K 500K 1M 5M 10M 30M
Frequency(Hz)
10
20
30
40
50
60
70
80
90
L
ev
e l (d
B
µV
)
EN 55022 Class B Conducted Av erage dBuV
Figure 51. EMC signature using above filter, SW003A0A.
For further information on designing for EMC compliance,
please refer to the FLTR100V10 data sheet (FDS01-043EPS).
Layout Considerations
The SW/SC power module series are low profile in order to be
used in fine pitch system card architectures. As such,
component clearance between the bottom of the power
module and the mounting board is limited. Avoid placing
copper areas on the outer layer directly underneath the power
module. Also avoid placing via interconnects underneath the
power module.
For additional layout guide-lines, refer to the FLTR100V10 data
sheet.
The SW/SC family of power modules is available for either
Through-Hole (TH) or Surface Mount (SMT) soldering.
Through-Hole Soldering Information
The RoHS-compliant (Z codes) through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed through
single or dual wave soldering machines. The pins have an
RoHS-compliant finish that is compatible with both Pb and Pb-
free wave soldering processes. A maximum preheat rate of
3
 C/s is suggested. The wave preheat process should be such
that the temperature of the power module board is kept below
210
 C. For Pb solder, the recommended pot temperature is
260  C, while the Pb-free solder pot is 270  C max. Not all RoHS-
compliant through-hole products can be processed with paste-
through-hole Pb or Pb-free reflow process. If additional
information is needed, please consult with your GEPower
representative for more details.
Surface Mount Information
Pick and Place
The SW/SC-SR series of DC-to-DC power converters use an
open-frame construction and are designed for surface mount
assembly within a fully automated manufacturing process.
The SW/SC-SR series modules are designed to use the main
magnetic component surface to allow for pick and place.
12.70
10.7
Ø6.5 NOZZLE.
Note: All dimensions in mm.
Figure 52. Pick and Place Location.
Z Plane Height
The ‘Z’ plane height of the pick and place location is 7.50mm
nominal with an RSS tolerance of +/-0.25 mm.
Nozzle Recommendations
The module weight has been kept to a minimum by using open
frame construction. Even so, they have a relatively large mass
when compared with conventional SMT components.
Variables such as nozzle size, tip style, vacuum pressure and
placement speed should be considered to optimize this
process.
The minimum recommended nozzle diameter for reliable
operation is 5mm. The maximum nozzle outer diameter, which
will safely fit within the allowable component spacing, is
6.5mm.
Oblong or oval nozzles up to 11 x 6 mm may also be used
within the space available.
For further information please contact your local GE Sales
Representative.