GE Industrial Solutions SW-SC001-003 Series - Manual (Page 15)

GE Data Sheet
SW/SC001/003 Series DC-DC Power Module
18-36Vdc & 36-75Vdc Input; 3.3-15Vdc Output; 1-3.5A Output Current
October 14, 2013 ©2013 General Electric Company. All rights reserved. Page 15
Feature Descriptions (continued)








 


 H
K L V
L G
R
adj o
up adj
) (
,
Note: Values for G, H, L and K are defined for each module
version in the following table 1.
Vout+
TRIM
Vout-
R
adj-up
R
LOAD
Vin+
ON/OFF
Vin-
Figure 48. Circuit Configuration to Increase Output Voltage.
Table 1. Trim Constants SW series
Module G H K L
Sx001A0C 10,000 5110 12.5 2.5
Sx001A2B 10,000 5110 9.5 2.5
Sx003A0A 5110 2050 2.5 2.5
Sx003A5F 5110 2050 0.8 2.5
The combination of the output voltage adjustment and the
output voltage initial tolerance must not exceed the allowable
trim range of 90% to 110% of the nominal output voltage as
measured between the Vout+ and Vout- pins.
The SW/SC power modules have a fixed current-limit set point.
Therefore, as the output voltage is adjusted down, the available
output power is reduced.
Trim Examples
For SW003A0A, nominal 5.0V module. To trim module down to
4.90V:









 

 2050
) 9 . 4 0 . 5 (
5110 ) 5 . 2 9 . 4 (
down adj
R
 
 590 , 120
down adj
R
Thermal Considerations
The power modules operate in a variety of thermal
environments; however, sufficient cooling should be provided
to help ensure reliable operation.
Considerations include ambient temperature, airflow, module
power dissipation, and the need for increased reliability. A
reduction in the operating temperature of the module will
result in an increase in reliability. The thermal data presented
here is based on physical measurements taken in a wind
tunnel.
The thermal reference point, T
ref
used in the specifications is
shown in Figure 49. For reliable operation this temperature
should not exceed 120
o C.
Tref
Figure 49. T
ref
Temperature Measurement Location.
Heat Transfer via Convection
Increased airflow over the module enhances the heat transfer
via convection. Derating figures showing the maximum output
current that can be delivered by each module versus local
ambient temperature (T
A
) for natural convection and up to
3m/s (600 ft./min) are shown in the respective Characteristics
Curves section.
Please refer to the Application Note “Thermal Characterization
Process For Open-Frame Board-Mounted Power Modules” for a
detailed discussion of thermal aspects including maximum
device temperatures.
EMC Considerations
Figure 50 shows a suggested configuration to meet the
conducted emission limits of EN55022 Class B.
Notes: C1, C2, C3 and C6 are low impedance SMT ceramics. C4
is a low impedance polymer film type (Paktron CS4). Common
Mode inductor is Pulse Engineering type P0354 1.17mH.