GE Industrial Solutions EQW012-020-023-025 Series - Manual (Page 23)

Data Sheet
October 5, 2013
EQW012/020/023/025 Series, Eighth-Brick Power Modules:
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
LINEAGE POWER 23
Surface Mount Information (continued)
Tin Lead Soldering
The recommended linear reflow profile using Sn/Pb
solder is shown in Figure 49 and 50. For reliable
soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
R
E
FL
O
W
TE
M
P
(
C)
0
50
100
150
200
250
300
Preheat zo ne
max 4
o Cs -1
Soak zo ne
30-240s
Heat zone
max 4
o Cs -1
Peak Temp 235 o C
Co oling
zone
1-4
o Cs -1
T
lim
above
205 o C
REFLOW TIME (S)
Figure 49. Recommended Reflow Profile for Sn/Pb
Solder.
M
A
X
TEM
P
SOLDER (
C)
200
205
210
215
220
225
230
235
240
0 10 20 30 40 50 60
TIME LIMIT (S)
Figure 50. Time Limit, T
lim
, Curve Above 205 o C
Reflow .
Lead Free Soldering
The –Z version SMT modules of EQW series are
lead-free (Pb-free) and RoHS compliant and are
compatible in a Pb-free soldering process. Failure to
observe the instructions below may result in the
failure of or cause damage to the modules and can
adversely affect long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. D
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Fig. 51.
Figure 51. Recommended linear reflow profile
using Sn/Ag/Cu solder.
MSL Rating
The EQW series SMT modules have a MSL rating of
2a.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of
 30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A).
The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Lineage Power Board
Mounted Power Modules: Soldering and Cleaning
Application Note (AN04-001).