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Figure 7. back plate pins, Back plate pins – Intel 915GME User Manual

Page 52

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Mobile Intel

®

915GME Express Chipset —Heat Sink Installation Instructions

Mobile Intel

®

915GME Express Chipset

Development Kit User’s Manual

April 2007

52

Order Number: 317230-001US

4. Clean the die of the processor with isopropyl alcohol before the heat sink is

attached to the processor. This ensures that the surface of the die is clean.

5. Place the heat sink over the pins of the heat sink back plate. Slide the heat sink

over the lugs on the back plate pins so that the base is directly over the processor

die. Turn the heat sink clockwise until it contacts the die. Then turn the heat sink ¼

turn to tighten it. The heat sink should be snug but not tight.

Caution:

Overtightening the heat sink could cause excessive pressure on the die and damage

the processor.

6. Plug the fan connector for the heat sink onto the CPU fan header on the

motherboard.

Figure 7.

Back Plate Pins

Back plate

pins