Intel 915GME - Manual (Page 14)

Mobile Intel ® 915GME Express Chipset —Getting Started
Mobile Intel ® 915GME Express Chipset
Development Kit User’s Manual April 2007
14 Order Number: 317230-001US
2.0 Getting Started
This chapter identifies the evaluation kit’s key components, features and specifications.
It also details basic board setup and operation.
2.1 Overview
The evaluation board consists of a baseboard populated with the Mobile Intel ® 915GME
Express Chipset , other system board components, and peripheral connectors.
Note: The evaluation board is shipped as an open system allowing for maximum flexibility in
changing hardware configuration and peripherals. Since the board is not in a protective
chassis, take extra precaution when handling and operating the system.
2.1.1 Mobile Intel ® 915GME Express Chipset Features
Features of the development kit board are summarized below:
Processor
• Supports Intel ® Pentium ® M Processor with 2 MByte L2 Cache on 90 nm process in
the 478 pin Flip Chip Pin Grid Array (Micro-FCPGA) package
— Supported processors are the Intel ® Pentium ® M 760 Processor and the Intel ®
Pentium ® M 738 Processor
• Supports Intel ® Celeron ® M Processor on 90 nm process in the 478 pin Flip Chip
Pin Grid Array (Micro-FCPGA) package
— Supported processors are the Intel ® Celeron ® M 370 Processor and the Intel ®
Celeron ® M 373 Processor
Note: This reference platform does not support the Intel ® Pentium ® M 745 Processor.
Mobile Intel ® 915GME Express Graphics Memory Controller Hub (915GME
Express GMCH)
• 1257 pin Micro-FCBGA Package
• Supports a 400/533 MHz front side bus
• Dual-Channel DDR2 at 400/533 MHz
• Two SODIMM slots (one per channel) support DDR2 SODIMMS (unbuffered, non-
ECC) modules
• Supports 128 MBytes to 2 GBytes using 256 Mbit, 512 Mbit, or 1 Gbit technology
• x16 PCI Express Graphics or Serial Digital Video Out (SDVO) port
• LVDS, VGA support
I/O Controller Hub 6 (ICH6-M)
• 609 pin plastic BGA package
• DMI (x4) interface with GMCH