HP DV3 - Manual (Page 121)

Removal and replacement procedures
Maintenance and Service Guide 4–59
✎
Due to the adhesive quality of the thermal material located between the fan/heat sink assembly and system board
components, it may be necessary to move the fan/heat sink assembly from side to side to detach the assembly.
✎
The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly and the system
board each time the fan/heat sink assembly is removed:
■ Thermal paste is used on the processor 1 and the heat sink section 2 that services it.
■ Thermal pads are used on the Northbridge chip 3 and the heat sink section 4 that services it.
■ Thermal pads are used on the other system board components 5 and sections of the heat sink 6 that
service them.
Replacement thermal material is included with all system board, fan/heat sink assembly, and processor spare
part kits.
Reverse this procedure to install the fan/heat sink assembly.