Ivoclar Vivadent Telio CAD A16 - Manual (Page 13)

Careful preparation of the bonding surfaces is a prerequisite for optimum adhesive cementation of the
Telio CAD structure to the Ti base. The following paragraphs outline the required procedures.
Required materials
– SR Connect
– Monobond
® Plus
– Multilink ® Hybrid Abutment HO 0
– Liquid Strip
Telio CAD A16 Ti base
Blasting – Observe manufacturer's instructions.
Cementation preparation Telio CAD
Apply SR Connect on the adhesive
surface to the Ti base, allow to react
for 30 s and polymerize for 40 s with
a polymerization device
(Bluephase ® Style).
–
Preparation for cementation –
Wet adhesive surface with
Monobond Plus for 60 s.
Cementation Multilink ® Hybrid Abutment HO 0
Covering the cementation joint Liquid Strip
Curing Auto-polymerization: 7 min
Polishing the cementation joint Customary polishers for resin materials and polishing paste
Preparation of the Ti base
The following procedure should be observed when preparing the Ti base for the cementation with the Telio CAD structure:
– Prepare the Ti base according to the instructions of the manufacturer.
– Clean the Ti base in an ultrasonic bath or with the steam jet and then dry with blown air.
– Screw the Ti base onto a model analog.
– Place the Telio CAD structure on the Ti base and mark the relative position of the components with a waterproof pen.
This facilitates locating the correct position when the parts are assembled at a later stage.
– Do not blast or modify the emergence profile of the Ti base any way.
– If the manufacturer recommends that the bonding surface of the base be blasted, the following procedure
should be observed:
– Protect the emergence profile and the screw channel, e.g. by means of a silicone (Virtual ® Extra Light Body Fast Set).
– Carefully blast the bonding area according to the instructions of the manufacturer.
– Remove silicone.
– Clean the Ti Base in an ultrasounic bath or with the steam jet.
– After the bonding surface has been cleaned, it must not be contaminated under any circumstances as this would
impair the bond.
– Note: Aggressive blasting negatively affects the anti-rotation lock. Blasting with max. 50 µm at 1–2 bar (15–29 psi) pres-
sure is recommended.
– Apply Monobond Plus on the cleaned bonding surface and allow to react for 60 s. After the reaction time, dry the
remaining residue with water- and oil-free air.
– Seal the screw channel with a foam pellet or wax. The bonding surface must not be contaminated in the process.
13
Telio
®
CAD Abutment Solutions
Cementation of Ti Base / Telio CAD Structure
Telio
®
CAD Abutment Solutions
– Completing the T
elio CAD Structur
e | Cementation of Ti Base / T
elio CAD Structur
e