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Howtorfid – Avery Dennison RFID User Manual

Page 31

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HowToRFID

Revision: 13

Date: 31 August 2009

Page 31 of 53

4.2.2

RFID Label Design & Printer Setup Guide + RFID Suppy Specifications

Avery Dennison publishes documents called “RFID Label Design & Printer Setup Guide”. The content of this
document is the essential extract of the inlay qualification process required for system setup.

There are several “RFID Label Design & Printer Setup Guides”, one for each RFID enabled printer and RF
regulatory region. So care must be taken to use the right document as reference.

Having a specific requirement in an RFID application to use transponder (inlay) A from manufacturer B, it’s often a
question to find out what RFID enabled printer is the best to meet given requirements for label design.

In this case it’s a good idea to have a look inside another type of document. Additionally there is one document
called “RFID Supply Specification” for each transponder (inlay). This document contains some more details about
the transponder / inlay and the parameters for usage in the Avery Dennison printers. The parameters for all printers
are contained in the specification for that inlay and can be easily compared. Additionally the document contains
manufacturer’s part numbers, inlay dimensions, chip data etc.

4.2.3

Terms used in the inlay specifications and related documents

Transponder / inlay placement dimensions

Dim. Definition

Explanation

LA

Inlay position
from top of label
“offset”

This dimension is selected to ensure best operating throughput in the printer by having the inlay at the right
position for encoding, when the top of the label is at the dot line of the print head. This dimension is printer
model specific
Please note: the distance is always to the antenna leading edge, not the chip or transponder carrier (inlay base
material). This distance is generally given with a +/- 1.5 mm tolerance (otherwise see notes).
If required, a deviating inlay position is possible, but requires adaptation of the OPL dimension and leads to
decreased throughput.
For the system specific placement window see Table 13 below.