Altera Stratix II GX EP2SGX90 Transceiver Signal Integrity Development Board - Manual (Page 37)

Altera Corporation Reference Manual 2–27
May 2006 Stratix II GX EP2SGX90 Transceiver Signal Integrity Development Board
Board Components & Interfaces
Thermal
Management
Block To ensure that the Stratix II GX device operates in the specified thermal
operating conditions, a thermal management unit is included on the
board. The on-chip temperature sensing diode needs to be monitored by
an external temperature sensor, which is the Maxim MAX1619 device
(U17). Accordingly, a SMBus interface in the PLD fabric of the
Stratix II GX device is required to monitor the thermal data, and
potentially, be an active participant with the active-cooling mechanism.
Figure 2–17 shows the on-board thermal management system diagram.
Figure 2–17. Stratix II GX Thermal Management System
The active-cooling device is similar to the Radian FB35+K52+T725 active
BGA cooler with clip.
f
For more information, go to the Radian website at
http://www.radianheatsinks.com/products.html.
Temperature
Sensing
Device
Tempdiodep
Tempdioden
FET
Stratix De v ice