Bimba IntelliSens - Manual (Page 20)

IntelliSense ® Manual
20
SIM Installation
DIP Switch Settings
The IntelliSense ® SIM module has a bank of DIP switches that allow for a variety of different architectural configura-
tions. The DIP switch bank is located under the rear cover of the SIM unit. Before mounting your SIM unit, it is impor-
tant that the DIP switches are configured to match the installation type being used. The SIM unit’s DIP switch setting
can be grouped in two categories:
• Power Source/Discrete Output
• Network Configuration/MODBUS Settings
Figure 5: Default DIP switch settings
Table 2: IntelliSense ® Sensor Interface Module Dip Switch Settings
DIP Switch Port OFF-0 ON-1 Default
1, 2, 3, 4* Both Communication ports unlinked Communication ports linked 0,0,0,0
5, 6* Modbus** 4-wire RS-422 or RS-485 2-wire RS-485 1, 1
7 Modbus
150 ohm terminating resistor
unconnected
150 ohm terminating resistor con-
nected
0
8 N/A
This switch should remain off
for all configurations
Not Used 0
9 I/O Connector
Isolates Pin 4 from ground to al-
low for EOT outputs to be used
Connects Pin 4 to ground to allow
for SIM to be powered via I/O con-
nector
1
10 Modbus** Unties Channel A from +5V
Ties Channel A to +5V via 680 Ω
resistor
0
11 Modbus** Unties Channel B from ground
Ties Channel B to ground via 680 Ω
resistor
0
12 N/A Not Used Not Used N/A
*Switches should be changed together
**Affects both ports if they are linked (DIP 1-4 ON)
Power Source and Discrete Output Settings
By setting DIP switch 9 to ON, the SIM unit may be powered using 4 pin I/O connector. See Using IntelliSense ® I/O
Connector for information on wiring. This is the default setting.
When DIP switch 9 is OFF, the user may use the EOT outputs of the 4 pin I/O connector. See Using IntelliSense ®
I/O Connector for information on wiring.