6 thermal design considerations, 1 thermal management, 2 heat spreader dimensions – Kontron SMARC-sAT30 User Manual
Page 76: Figure 16: heat spreader, Thermal design considerations, Thermal management, Heat spreader dimensions, 6thermal design considerations
User’s Guide
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6
Thermal Design Considerations
6.1
Thermal Management
An optional heat spreader plate assembly is available from Kontron for the SMARC sAT30 module. The heat spreader
plate on top of this assembly is NOT a heat sink. It works as a SMARC®- standard thermal interface to be used with a
heat sink or other cooling device.
External cooling must be provided to maintain the heat spreader plate at proper operating temperatures. Under worst-
case conditions, the cooling mechanism must maintain an ambient air and heat spreader plate temperature of 60° C or
less.
The aluminum slugs and thermal pads on the underside of the heat spreader assembly implement thermal interfaces
between the heat spreader plate and the major heat-generating components on the sAT30 Module. About 80% of the
power dissipated within the module is conducted to the heatspreader plate and can be removed by the cooling
solution.
You can use passive thermal-management solutions with the heatspreader plates. The optimum cooling solution
varies, depending on the SMARC® application and environmental conditions.
6.2
Heat Spreader Dimensions
The SMARC sAT30 module includes two mounting holes for mounting the passive heat sink, located to the left and
right of the T30 SoC. Heat spreader dimensions are shown in the diagram below. (TIM” stands for Thermal Interface
Material)
Figure 16: Heat Spreader