Kontron COMe-bP5020 - Manual (Page 45)

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User Guide
COMe-bP5020
5 Ther mal
5.1 Heatspreader
The thermal concept of the COMe-bP5020 is based on a specially designed full-board heatspreader which contacts the main hot
spots of the board and therefore provides optimal heat transfer from the board's top surface.
The heatspreader plate is NOT a heat sink. It serves as a COM Express® standard thermal interface for use with a heat sink or
other cooling solution. Various thermal management solutions can be used with the heatspreader plate, including active and
passive approaches. The optimal cooling solution will vary, depending on the COM Express® application and environmental
conditions.
Cooling of the COMe-bP5020 is a function of the attached heatsink or other heat transfer mechanism which must provide ade-
quate cooling capability. To determine cooling performance, the module temperature can be measured at the temperature
measurement point “M” indicated in the figure below.
The cooling solution, be it active or passive, must in any event maintain a heatspreader plate temperature of 80°C or less.
F igure 6: COMe-bP5020 Heatspreader
5.2 Cooling Considerations
The COMe-bP5020 is delivered either with a heatspreader plate or a Kontron off-the-shelf cooling solution preassembled.
Kontron provides two off-the-shelf cooling solutions. One for passive cooling and the other for active cooling. The usage of
one or the other of these two cooling solutions will result in the following maximum possible ambient air operating tempera-
tures as indicated in the table below. Please contact Kontron Support for more information about available off-the-shelf solu-
tions.
Table 40: Maximum Ambient Air Temperature for Two Kontron Cooling Solutions
COOLING
SOLUTION
MAXIMUM AMBIENT
AIR TEMPERATURE
ORDER
NUMBER
PASSIVE
(specially designed heat sink
without heatspreader)
55° C tbs
ACTIVE
(with heatspreader and fan)
75° C 36099-0000-99-0-R2.0
M = measurement point
heatspreader