HMC Electronics 62040 Loctite 620 Retaining Compound, High Temperature User Manual
Page 2
TDS LOCTITE
®
620, May
-
2004
TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties:
Coefficient of Thermal Expansion, ASTM D 696, K
-1
80×10
-6
Coefficient of Thermal Conductivity, ASTM C 177,
W/(m·K)
0.10
Specific Heat, kJ/(kg·K)
0.30
Elongation, at break, ASTM D 412, %
<1
TYPICAL PERFORMANCE OF CURED MATERIAL
Adhesive Properties
After 24 hours @ 22 °C
Compressive Shear Strength, ISO 10123:
Steel pins and collars
N/mm² ≥17.20
LMS
(psi) (2,495)
Cured for 24 hours @ 22 °C, followed by 24 hours @ 177 °C,
tested @ 22 °C
Compressive Shear Strength, ISO 10123:
Steel pins and collars
N/mm² ≥24.10
LMS
(psi) (3,495)
TYPICAL ENVIRONMENTAL RESISTANCE
Cured for 1 week @ 22 °C
Compressive Shear Strength, ISO 10123:
Steel pins and collars
Hot Strength
Tested at temperature
% RT Strength
Temperature, °C
125
100
75
50
25
0
0
50
100
150
200
250
Heat Aging
Aged at temperature indicated and tested @ 22 °C
% Initial Strength at RT
Hours
200
150
100
50
0
0
100
500
1000
3000
5000
120°C
150°C
180°C
Chemical/Solvent Resistance
Aged under conditions indicated and tested @ 22 °C.
% of initial strength
Environment
°C
100 hr
500 hr
1000 hr
Motor Oil
125
100
100
100
Unleaded Petrol
22
95
95
95
Brake fluid
22
100
100
100
Water Glycol 50/50
87
95
80
80
Ethanol
22
100
100
75
Acetone
22
95
95
95
GENERAL INFORMATION
This product is not recommended for use in pure oxygen
and/or oxygen rich systems and should not be selected as
a sealant for chlorine or other strong oxidizing materials.
For safe handling information on this product, consult the
Material Safety Data Sheet (MSDS).
Where aqueous washing systems are used to clean the
surfaces before bonding, it is important to check for
compatibility of the washing solution with the adhesive. In
some cases these aqueous washes can affect the cure and
performance of the adhesive.
This product is not normally recommended for use on plastics
(particularly thermoplastic materials where stress cracking of
the plastic could result). Users are recommended to confirm
compatibility of the product with such substrates.
Directions for use
For Assembly
1. For best results, clean all surfaces (external and internal)
with a Loctite cleaning solvent and allow to dry.
2. If the material is an inactive metal or the cure speed is to
slow, spray with Activator 7471 or 7649 and allow to dry.
3. Shake the product thoroughly before use.
4. For Slip Fitted Assemblies, apply adhesive around the
leading edge of the pin and the inside of the collar and
use a rotating motion during assembly to ensure good
coverage.
5. For Press Fitted Assemblies, apply adhesive thoroughly
to both bond surfaces and assemble at high press on
rates.
6. For Shrink Fitted Assemblies the adhesive should be
coated onto the pin, the collar should then be heated to
create sufficient clearance for free assembly.
7. Parts should not be disturbed until sufficient handling
strength is achieved.
For Disassembly
1. Apply localized heat to the assembly to approximately 250
°C. Disassemble while hot.
For Cleanup
1. Cured product can be removed with a combination of
soaking in a Loctite solvent and mechanical abrasion
such as a wire brush.
Henkel Loctite Americas
+860.571.5100
Henkel Loctite Europe
+49.89.9268.0
Henkel Loctite Asia Pacific
+81.45.758.1810
For the most direct access to local sales and technical support visit: www.loctite.com
Documentation Provided By HMC Electronics
33 Springdale Ave. Canton, MA 02021
(800) 482-4440