HMC Electronics 49550 Loctite 495 SuperBonder, Instant Adhesive, General Purpose - Manual

Technical Data Sheet
LOCTITE
®
495
May - 2004
PRODUCT DESCRIPTION
LOCTITE
®
495 provides the following product characteristics:
Technology Cyanoacrylate
Chemical Type Ethyl cyanoacrylate
Appearance (uncured) Transparent, colorless to straw
colored liquid LMS
Components One part - requires no mixing
Viscosity Low
Cure Humidity
Application Bonding
Key Substrates Plastics, Rubbers and Metals
LOCTITE ® 495 is a general purpose cyanoacrylate instant
adhesive.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.05
Viscosity, Cone & Plate, mPa·s (cP):
Temperature: 25 °C, Shear Rate: 3,000 s -1 20 to 45 LMS
Viscosity, Brookfield - LVF, 25 °C, mPa·s (cP):
Spindle 1, speed 30 rpm 20 to 60
Vapour Pressure, hPa <1
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Under normal conditions, the atmospheric moisture initiates the
curing process. Although full functional strength is developed
in a relatively short time, curing continues for at least 24 hours
before full chemical/solvent resistance is developed.
Cure Speed vs. Substrate
The rate of cure will depend on the substrate used. The table
below shows the fixture time achieved on different materials at
22 °C / 50 % relative humidity. This is defined as the time to
develop a shear strength of 0.1 N/mm².
Fixture Time, ISO 4587, seconds:
Mild Steel (degreased) 10 to 30
Aluminum (degreased) 5 to 15
Zinc Dichromate 30 to 90
Neoprene <5
Rubber, Nitrile <5
ABS 10 to 30
PVC 3 to 10
Polycarbonate 20 to 60
Phenolic 5 to 20
Cure Speed vs. Bond Gap
The rate of cure will depend on the bondline gap. Thin bond
lines result in high cure speeds, increasing the bond gap will
decrease the rate of cure.
Cure Speed vs. Humidity
The rate of cure will depend on the ambient relative humidity.
The following graph shows the tensile strength developed with
time on Buna N rubber at different levels of humidity.
% Full Cured Strength @ RT
Cure Time, seconds
100
75
50
25
0
0 10 20 30 40 50 60
60% RH
40% RH
20% RH
Cure Speed vs. Activator
Where cure speed is unacceptably long due to large gaps,
applying activator to the surface will improve cure speed.
However, this can reduce ultimate strength of the bond and
therefore testing is recommended to confirm effect.
TYPICAL PROPERTIES OF CURED MATERIAL
After 24 hours @ 22 °C
Physical Properties:
Coefficient of Thermal Expansion, ASTM D 696, K -1 100×10 -6
Coefficient of Thermal Conductivity, ASTM C 177,
W/(m·K)
0.10
Softening Point, °C 165
Electrical Properties:
Dielectric Constant / Dissipation Factor, ASTM D 150:
0.10 - kHz 2 to 3.30 / <0.02
1 - kHz 2 to 3.50 / <0.02
10 - kHz 2 to 3.50 / <0.02
Volume Resistivity, ASTM D 257, Ω·cm 2×10 15 to 10×10 15
Surface Resistivity, ASTM D 257, Ω 10×10 15 to 80×10 15
Dielectric Breakdown Strength, ASTM D
149, kV/mm
25
TYPICAL PERFORMANCE OF CURED MATERIAL
Adhesive Properties
After 24 hours @ 22 °C
Lap Shear Strength, ISO 4587:
Steel (grit blasted) N/mm² 12 to 26
(psi) (1,740 to 3,770)
Aluminum (grit blasted) N/mm² 12 to 19
(psi) (1,740 to 2,755)
Zinc Dichromate N/mm² 6 to 13
(psi) (870 to 1,885)
ABS N/mm² 6 to 20
(psi) (870 to 2,900)
PVC N/mm² 6 to 20
(psi) (870 to 2,900)
Polycarbonate N/mm² 5 to 20
(psi) (725 to 2,900)
Phenolic N/mm² 5 to 15
(psi) (725 to 2,175)
Neoprene N/mm² 5 to 15
(psi) (725 to 2,175)
Documentation Provided By HMC Electronics
33 Springdale Ave. Canton, MA 02021
http://www.hmcelectronics.com
(800) 482-4440