HMC Electronics 43050 Loctite 430 SuperBonder, Instant Adhesive, Metal Bonder, Close Fitting Parts - Manual

Technical Data Sheet
LOCTITE
®
430™
November - 2010
PRODUCT DESCRIPTION
LOCTITE
®
430™ provides the following product
characteristics:
Technology Cyanoacrylate
Chemical Type Methyl cyanoacrylate
Appearance (uncured) Transparent, colorless liquid LMS
Components One part - requires no mixing
Viscosity Low
Cure Humidity
Application Bonding
Key Substrates Metals, Rubbers and Plastics
LOCTITE
®
430™ is a general purpose adhesive and is
particularly suited to bonding of metal substrates.
Commercial Item Description A-A-3097:
LOCTITE
® 430™ has been qualified to Commercial Item
Description A-A-3097. Note: This is a regional approval.
Please contact your local Technical Service Center for more
information and clarification.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.1
Viscosity, Cone & Plate, mPa·s (cP):
Temperature: 25 °C, Shear Rate: 3,000 s -1 60 to 90
Viscosity, Brookfield - LVF, 25 °C, mPa·s (cP):
Spindle 1, speed 30 rpm 70 to 110 LMS
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Under normal conditions, the atmospheric moisture initiates the
curing process. Although full functional strength is developed
in a relatively short time, curing continues for at least 24 hours
before full chemical/solvent resistance is developed.
Cure Speed vs. Substrate
The rate of cure will depend on the substrate used. The table
below shows the fixture time achieved on different materials
at 22 °C / 50 % relative humidity. This is defined as the time to
develop a shear strength of 0.1 N/mm².
Fixture Time, seconds:
Steel (degreased) 20 to 40
Aluminum 30 to 60
Zinc dichromate 40 to 70
Neoprene <10
Rubber, nitrile <10
ABS 10 to 30
PVC 30 to 70
Polycarbonate 20 to 70
Phenolic 10 to 30
Cure Speed vs. Bond Gap
The rate of cure will depend on the bondline gap. Thin bond
lines result in high cure speeds, increasing the bond gap will
decrease the rate of cure.
Cure Speed vs. Humidity
The rate of cure will depend on the ambient relative humidity.
The following graph shows the tensile strength developed with
time on Buna N rubber at different levels of humidity.
% Full Cured Strength @ 22 °C
Cure Time, seconds
100
75
50
25
0
0 10 20 30 40 50 60
60% RH
40% RH
20% RH
Cure Speed vs. Activator
Where cure speed is unacceptably long due to large gaps,
applying activator to the surface will improve cure speed.
However, this can reduce ultimate strength of the bond and
therefore testing is recommended to confirm effect.
TYPICAL PROPERTIES OF CURED MATERIAL
Cured for 24 hours @ 22 °C
Physical Properties:
Coefficient of Thermal Expansion,
ISO 11359-2, K -1
100×10 -6
Coefficient of Thermal Conductivity, ISO 8302,
W/(m·K)
0.1
Glass Transition Temperature, ASTM E 228, °C 165
Electrical Properties:
Dielectric Constant / Dissipation Factor, IEC 60250:
0.1 - kHz 2.65 / <0.02
1 - kHz 2.75 / <0.02
10 - kHz 2.75 / <0.02
Volume Resistivity, IEC 60093, Ω·cm 10×10 15
Surface Resistivity, IEC 60093, Ω 10×10 15
Dielectric Breakdown Strength,
IEC 60243-1, kV/mm
25
TYPICAL PERFORMANCE OF CURED MATERIAL
Adhesive Properties
Cured for 24 hours @ 22 °C
Lap Shear Strength, ISO 4587:
Steel (grit blasted) N/mm² 20 to 30
(psi) (2,900 to 4,350)
Aluminum (grit blasted) N/mm² 15 to 22
(psi) (2,175 to 3,190)
Zinc dichromate N/mm² 4 to 12
(psi) (580 to 1,740)
ABS N/mm² 6 to 20
(psi) (870 to 2,900)
PVC N/mm² 6 to 20
(psi) (870 to 2,900)
Documentation Provided By HMC Electronics
33 Springdale Ave. Canton, MA 02021
http://www.hmcelectronics.com
(800) 482-4440