HMC Electronics 38050 Loctite 380 Black Max Tough Instant Adhesive - Manual

Technical Data Sheet
LOCTITE
®
380
May - 2004
PRODUCT DESCRIPTION
LOCTITE
®
380 provides the following product characteristics:
Technology Cyanoacrylate
Chemical Type Ethyl cyanoacrylate
Appearance (uncured) Black liquid LMS
Components One part - requires no mixing
Viscosity Medium
Cure Humidity
Application Bonding
Key Substrates Metals, Plastics and Rubbers
LOCTITE
®
380 is a rubber toughened adhesive with increased
flexibility and peel strength along with enhanced resistance to
shock.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.1
Viscosity, Brookfield - RVT, 25 °C, mPa·s (cP):
Spindle 3, speed 50 rpm 100 to 800 LMS
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Under normal conditions, the atmospheric moisture initiates the
curing process. Although full functional strength is developed
in a relatively short time, curing continues for at least 24 hours
before full chemical/solvent resistance is developed.
Cure Speed vs. Substrate
The rate of cure will depend on the substrate used. The table
below shows the fixture time achieved on different materials
at 22 °C / 50 % relative humidity. This is defined as the time to
develop a shear strength of 0.1 N/mm².
Fixture Time, ISO 4587, seconds:
Steel (degreased) 60 to 120
Aluminum 10 to 30
Neoprene 15 to 25
Rubber, nitrile 15 to 25
ABS 20 to 50
PVC 50 to 100
Polycarbonate 30 to 90
Phenolic 20 to 60
Cure Speed vs. Bond Gap
The rate of cure will depend on the bondline gap. Thin bond
lines result in high cure speeds, increasing the bond gap will
decrease the rate of cure.
Cure Speed vs. Activator
Where cure speed is unacceptably long due to large gaps,
applying activator to the surface will improve cure speed.
However, this can reduce ultimate strength of the bond and
therefore testing is recommended to confirm effect.
TYPICAL PROPERTIES OF CURED MATERIAL
After 24 hours @ 22 °C
Physical Properties:
Coefficient of Thermal Expansion, ASTM D 696, K -1 80×10 -6
Coefficient of Thermal Conductivity, ASTM C 177,
W/(m·K)
0.1
Glass Transition Temperature, ASTM E 228, °C 120
Electrical Properties:
Dielectric Constant / Dissipation Factor, ASTM D 150:
0.05 - kHz 2.65 / <0.02
1 - kHz 2.75 / <0.02
1,000 - kHz 2.75 / <0.02
Volume Resistivity, ASTM D 257, Ω·cm 10×10 15
Dielectric Breakdown Strength, ASTM D 149, kV/mm 25
TYPICAL PERFORMANCE OF CURED MATERIAL
Adhesive Properties
After 24 hours @ 22 °C
Lap Shear Strength, ISO 4587:
Steel (grit blasted) N/mm² 26
(psi) (3,770)
Aluminum (etched) N/mm² 18
(psi) (2,610)
ABS N/mm² >6
(psi) (>870)
PVC N/mm² >4
(psi) (>580)
Polycarbonate N/mm² >5
(psi) (>725)
Phenolic N/mm² 10
(psi) (1,450)
Neoprene N/mm² >10
(psi) (>1,450)
Nitrile N/mm² >10
(psi) (>1,450)
Tensile Strength, ISO 6922:
Steel (grit blasted) N/mm² 18.5
(psi) (2,700)
After 48 hours @ 22 °C
Lap Shear Strength, ISO 4587:
Steel (grit blasted) N/mm² ≥17.2 LMS
(psi) (≥2,495)
Cured for 24 hours @ 22 °C, followed by 24 hours @ 121 °C,
tested @ 121 °C
Lap Shear Strength, ISO 4587:
Steel (grit blasted) N/mm² ≥6.9 LMS
(psi) (≥1,000)
Cured for 24 hours @ 22 °C, followed by 24 hours @ 121 °C,
tested @ 22 °C
Lap Shear Strength, ISO 4587:
Steel (grit blasted) N/mm² ≥19.3 LMS
(psi) (≥2,800)
Documentation Provided By HMC Electronics
33 Springdale Ave. Canton, MA 02021
http://www.hmcelectronics.com
(800) 482-4440