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HMC Electronics 41450 Loctite 414 SuperBonder, Instant Adhesive, Plastic Bonder User Manual

Loctite

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Technical Data Sheet

LOCTITE

®

414

November

-

2010

PRODUCT DESCRIPTION
LOCTITE

®

414 provides the following product characteristics:

Technology

Cyanoacrylate

Chemical Type

Ethyl cyanoacrylate

Appearance (uncured)

Transparent,

colorless

to

straw

colored liquid

LMS

Components

One part - requires no mixing

Viscosity

Low

Cure

Humidity

Application

Bonding

Key Substrates

Plastics, Rubbers and Metals

LOCTITE

®

414 is a general purpose cyanoacrylate instant

adhesive.

Commercial Item Description A-A-3097:
LOCTITE

®

414 has been qualified to Commercial Item

Description A-A-3097. Note: This is a regional approval.
Please contact your local Technical Service Center for more
information and clarification.

TYPICAL PROPERTIES OF UNCURED MATERIAL

Specific Gravity @ 25 °C

1.05

Viscosity, Cone & Plate, mPa·s (cP):

Temperature: 25 °C, Shear Rate: 3,000 s

-1

70 to 110

LMS

Viscosity, Brookfield - LVF, 25 °C, mPa·s (cP):

Spindle 1, speed 30 rpm

100 to 150

Flash Point - See MSDS

TYPICAL CURING PERFORMANCE

Under normal conditions, the atmospheric moisture initiates the

curing process. Although full functional strength is developed

in a relatively short time, curing continues for at least 24 hours

before full chemical/solvent resistance is developed.

Cure Speed vs. Substrate

The rate of cure will depend on the substrate used. The table

below shows the fixture time achieved on different materials

at 22 °C / 50 % relative humidity. This is defined as the time to

develop a shear strength of 0.1 N/mm².

Fixture Time, seconds:

Steel (degreased)

15 to 30

Aluminum

2 to 10

Neoprene

<5

Rubber, nitrile

<5

ABS

2 to 10

PVC

2 to 10

Polycarbonate

15 to 50

Phenolic

5 to 15

Cure Speed vs. Bond Gap

The rate of cure will depend on the bondline gap. Thin bond

lines result in high cure speeds, increasing the bond gap will

decrease the rate of cure.

Cure Speed vs. Activator

Where cure speed is unacceptably long due to large gaps,

applying activator to the surface will improve cure speed.

However, this can reduce ultimate strength of the bond and

therefore testing is recommended to confirm effect.

TYPICAL PROPERTIES OF CURED MATERIAL

After 24 hours @ 22 °C

Physical Properties:

Coefficient of Thermal Expansion,

ISO 11359-2, K

-1

80×10

-6

Coefficient of Thermal Conductivity, ISO 8302,

W/(m·K)

0.1

Glass Transition Temperature, ASTM E 228, °C 120

Electrical Properties:

Dielectric Constant / Dissipation Factor, IEC 60250:

0.05

-

kHz

2.3 / <0.02

1

-

kHz

2.3 / <0.02

10

-

kHz

2.3 / <0.02

Volume Resistivity, IEC 60093, Ω·cm

10×10

15

Dielectric Breakdown Strength,

IEC 60243-1, kV/mm

25

TYPICAL PERFORMANCE OF CURED MATERIAL

Adhesive Properties

After 24 hours @ 22 °C

Lap Shear Strength, ISO 4587:

Steel

(grit blasted)

N/mm² 18 to 26

(psi) (2,610 to 3,770)

Aluminum (etched)

N/mm² 11 to 19

(psi) (1,595 to 2,755)

ABS

N/mm² >6

(psi) (>870)

PVC

N/mm² >4

(psi) (>580)

Polycarbonate

N/mm² >5

(psi) (>725)

Phenolic

N/mm² 5 to 15

(psi) (725 to 2,175)

Neoprene

N/mm² >10

(psi) (>1,450)

Nitrile

N/mm² >10

(psi) (>1,450)

Tensile Strength, ISO 6922:

Steel (grit blasted)

N/mm² 12 to 25

(psi) (1,745 to 3,625)

After 10 seconds @ 22 °C

Tensile Strength, ISO 6922:

Buna-N

N/mm² ≥6.0

LMS

(psi) (≥870)

Documentation Provided By HMC Electronics

33 Springdale Ave. Canton, MA 02021

http://www.hmcelectronics.com

(800) 482-4440