HMC Electronics 40840 Loctite 408 Prism Instant Adhesive, Low Odor, Low Bloom, Wicking Grade - Manual

Technical Data Sheet
LOCTITE
®
408™
June - 2007
PRODUCT DESCRIPTION
LOCTITE
®
408™ provides the following product
characteristics:
Technology Cyanoacrylate
Chemical Type Alkoxyethyl cyanoacrylate
Appearance (uncured) Transparent, colorless to straw
colored liquid LMS
Components One part - requires no mixing
Viscosity Very low
Cure Humidity
Application Bonding
Key Substrates Metals, Plastics and Elastomers
LOCTITE ® 408™ has low odor and low blooming properties
and is particularly suitable for applications where vapor control
is difficult. The product provides rapid bonding of a wide range
of materials, including metals, plastics and elastomers.
LOCTITE
® 408™ is particularly suited for bonding porous or
absorbent materials such as wood, paper, leather and fabric.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.1
Flash Point - See MSDS
Viscosity, Cone & Plate, mPa·s (cP):
Temperature: 25 °C, Shear Rate: 3,000 s -1 4 to 10 LMS
Viscosity, Brookfield - LVF, 25 °C, mPa·s (cP):
Spindle 1, speed 60 rpm 4 to 10
TYPICAL CURING PERFORMANCE
Under normal conditions, the atmospheric moisture initiates the
curing process. Although full functional strength is developed
in a relatively short time, curing continues for at least 24 hours
before full chemical/solvent resistance is developed.
Cure Speed vs. Substrate
The rate of cure will depend on the substrate used. The table
below shows the fixture time achieved on different materials
at 22 °C / 50 % relative humidity. This is defined as the time to
develop a shear strength of 0.1 N/mm².
Fixture Time, seconds:
Steel 30 to 120
Aluminum <3
Zinc dichromate 10 to 20
Neoprene <5
Rubber, nitrile <5
ABS 5 to 10
PVC 15 to 30
Polycarbonate 10 to 15
Phenolic 5 to 15
Wood (pine) 10 to 20
Leather 5 to 10
Cure Speed vs. Bond Gap
The rate of cure will depend on the bondline gap. Thin bond
lines result in high cure speeds, increasing the bond gap will
decrease the rate of cure.
Cure Speed vs. Humidity
The rate of cure will depend on the ambient relative
humidity. The best results are achieved when the relative
humidity in the working environment is 40% to 60% at 22°C.
Lower humidity leads to slower cure. Higher humidity
accelerates it, but may impair the final strength of the bond.
Cure Speed vs. Activator
Where cure speed is unacceptably long due to large gaps,
applying activator to the surface will improve cure speed.
However, this can reduce ultimate strength of the bond and
therefore testing is recommended to confirm effect.
TYPICAL PROPERTIES OF CURED MATERIAL
Cured for 1 week @ 22 °C
Physical Properties:
Coefficient of Thermal Expansion, ISO 11359-2, K -1 476×10 -6
Coefficient of Thermal Conductivity, ISO 8302,
W/(m·K)
0.26
Glass Transition Temperature, ISO 11359-2, °C 172
Electrical Properties:
Volume Resistivity, IEC 60093, Ω·cm 130×10 15
Surface Resistivity, IEC 60093, Ω 11.9×10 15
Dielectric Breakdown Strength, IEC 60243-1, kV/mm 25
Dielectric Constant / Dissipation Factor, IEC 60250:
1 - kHz 4.57 / 0.03
1 - MHz 4.08 / 0.03
10 - MHz 3.97 / 0.04
TYPICAL PERFORMANCE OF CURED MATERIAL
Adhesive Properties
Cured for 10 seconds @ 22 °C
Tensile Strength, ISO 6922:
Buna-N N/mm² ≥4.5 LMS
(psi) (≥652)
Cured for 72 hours @ 22 °C
Tensile Strength, ISO 6922:
Buna-N N/mm² 9 to 15
(psi) (1,300 to 2,200)
Steel (grit blasted) N/mm² 12 to 20
(psi) (1,700 to 2,900)
Lap Shear Strength, ISO 4587:
Steel (grit blasted) N/mm² 17 to 23
(psi) (2,500 to 3,300)
Aluminum (etched) N/mm² 4 to 17
(psi) (580 to 2,500)
Zinc dichromate N/mm² 0.5 to 3
(psi) (70 to 440)
ABS N/mm² 8 to 11
(psi) (1,200 to 1,600)
PVC N/mm² 1 to 5
(psi) (150 to 730)
Documentation Provided By HMC Electronics
33 Springdale Ave. Canton, MA 02021
http://www.hmcelectronics.com
(800) 482-4440