HMC Electronics 40140 Loctite 401 Prism Instant Adhesive, Surface Insensitive, General Purpose - Manual

Technical Data Sheet
LOCTITE
®
401™
December - 2009
PRODUCT DESCRIPTION
LOCTITE
®
401™ provides the following product
characteristics:
Technology Cyanoacrylate
Chemical Type Ethyl cyanoacrylate
Appearance (uncured) Transparent, colorless to straw
colored liquid LMS
Components One part - requires no mixing
Viscosity Low
Cure Humidity
Application Bonding
Key Substrates Metals, Plastics and Elastomers
LOCTITE
®
401™ is designed for the assembly of difficult-
to-bond materials which require uniform stress distribution and
strong tension and/or shear strength. The product provides
rapid bonding of a wide range of materials, including metals,
plastics and elastomers. LOCTITE
® 401™ is also suited for
bonding porous materials such as woods, paper, leather and
fabric.
NSF International
Registered to NSF Category P1 for use as a sealant where
there is no possibilty of food contact in and around food
processing areas. Note: This is a regional approval. Please
contact your local Technical Service Center for more
information and clarification.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.06
Flash Point - See MSDS
Viscosity, Cone & Plate, mPa·s (cP):
Temperature: 25 °C, Shear Rate: 3,000 s -1 70 to 110 LMS
Viscosity, Brookfield - LVF, 25 °C, mPa·s (cP):
Spindle 1, speed 30 rpm 90 to 140
TYPICAL CURING PERFORMANCE
Under normal conditions, the atmospheric moisture initiates the
curing process. Although full functional strength is developed
in a relatively short time, curing continues for at least 24 hours
before full chemical/solvent resistance is developed.
Cure Speed vs. Substrate
The rate of cure will depend on the substrate used. The table
below shows the fixture time achieved on different materials
at 22 °C / 50 % relative humidity. This is defined as the time to
develop a shear strength of 0.1 N/mm².
Fixture Time, seconds:
Steel 20 to 45
Aluminum 2 to 10
Zinc dichromate 10 to 30
Neoprene <5
Rubber, nitrile <5
ABS 1 to 2
PVC 3 to 10
Polycarbonate 5 to 10
Phenolic <2
Wood (balsa) <1
Wood (oak) 10 to 30
Wood (pine) 10 to 20
Chipboard 5 to 10
Fabric 10 to 20
Leather 5 to 10
Paper 5 to 10
Cure Speed vs. Bond Gap
The rate of cure will depend on the bondline gap. Thin bond
lines result in high cure speeds, increasing the bond gap will
decrease the rate of cure.
Cure Speed vs. Humidity
The rate of cure will depend on the ambient relative humidity.
Higher relative humidity levels result in more rapid speed of
cure.
Cure Speed vs. Activator
Where cure speed is unacceptably long due to large gaps,
applying activator to the surface will improve cure speed.
However, this can reduce ultimate strength of the bond and
therefore testing is recommended to confirm effect.
TYPICAL PROPERTIES OF CURED MATERIAL
Cured for 1 week @ 22 °C
Physical Properties:
Coefficient of Thermal Expansion,
ISO 11359-2, K -1
107×10 -6
Coefficient of Thermal Conductivity, ISO 8302,
W/(m·K)
0.4
Glass Transition Temperature ISO 11359-2, °C 121
Electrical Properties:
Volume Resistivity, IEC 60093, Ω·cm 277×10 15
Surface Resistivity, IEC 60093, Ω 69×10 15
Dielectric Breakdown Strength,
IEC 60243-1, kV/mm
33
Dielectric Constant / Dissipation Factor, IEC 60250:
1 - kHz 2.72 / 0.02
1 - MHz 2.53 / 0.02
10 - MHz 2.42 / 0.01
Documentation Provided By HMC Electronics
33 Springdale Ave. Canton, MA 02021
http://www.hmcelectronics.com
(800) 482-4440