HMC Electronics 49850 Loctite 498 SuperBonder, Instant Adhesive, Thermal Cycling - Manual

Technical Data Sheet
LOCTITE
®
498
June - 2004
PRODUCT DESCRIPTION
LOCTITE
®
498 provides the following product characteristics:
Technology Cyanoacrylate
Chemical Type Ethyl cyanoacrylate
Appearance (uncured) Transparent, colorless to pale
yellow liquid LMS
Components One part - requires no mixing
Viscosity Medium
Cure Humidity
Application Bonding
Key Substrates Rubbers, Plastics and Metals
LOCTITE ® 498 is a general purpose adhesive suitable for
applications where heat resistance is required. LOCTITE ® 498
is formulated to resist thermal cycling and also exhibits
superior resistance to humidity.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.10
Viscosity, Brookfield - LVF, 25 °C, mPa·s (cP):
Spindle 2, speed 30 rpm 400 to 600 LMS
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Under normal conditions, the atmospheric moisture initiates the
curing process. Although full functional strength is developed
in a relatively short time, curing continues for at least 24 hours
before full chemical/solvent resistance is developed.
Cure Speed vs. Substrate
The rate of cure will depend on the substrate used. The table
below shows the fixture time achieved on different materials
at 22 °C / 50 % relative humidity. This is defined as the time to
develop a shear strength of 0.1 N/mm².
Fixture Time, ISO 4587, seconds:
Steel (degreased) 20 to 30
Aluminum 2 to 10
ABS 5 to 10
Phenolic 10 to 20
Cure Speed vs. Bond Gap
The rate of cure will depend on the bondline gap. Thin bond
lines result in high cure speeds, increasing the bond gap will
decrease the rate of cure.
Cure Speed vs. Activator
Where cure speed is unacceptably long due to large gaps,
applying activator to the surface will improve cure speed.
However, this can reduce ultimate strength of the bond and
therefore testing is recommended to confirm effect.
TYPICAL PROPERTIES OF CURED MATERIAL
After 24 hours @ 22 °C
Physical Properties:
Coefficient of Thermal Expansion, ASTM D 696, K -1 80×10 -6
Coefficient of Thermal Conductivity, ASTM C 177,
W/(m·K)
0.10
Glass Transition Temperature, ASTM E 228, °C 120
Electrical Properties:
Dielectric Constant / Dissipation Factor, ASTM D 150:
0.05 - kHz 2.30 / <0.02
1 - kHz 2.30 / <0.02
1,000 - kHz 2.30 / <0.02
Volume Resistivity, ASTM D 257, Ω·cm 10×10 15
Dielectric Breakdown Strength, ASTM D 149, kV/mm 25
TYPICAL PERFORMANCE OF CURED MATERIAL
Adhesive Properties
Cured for 24 hours @ 22 °C
Lap Shear Strength, ISO 4587:
Steel (grit blasted) N/mm² 19
(psi) (2,755)
Polycarbonate N/mm² 10
(psi) (1,450)
Phenolic N/mm² 10
(psi) (1,450)
Cured for 24 hours @ 22 °C, followed by 24 hours @ 121 °C,
tested @ 121 °C
Lap Shear Strength, ISO 4587:
Steel (grit blasted) N/mm² ≥6.90 LMS
(psi) (≥1,000)
Cured for 2 minutes @ 22 °C
Lap Shear Strength, ISO 4587:
Steel (grit blasted) N/mm² ≥4.80 LMS
(psi) (≥695)
TYPICAL ENVIRONMENTAL RESISTANCE
After 1 week @ 22 °C
Lap Shear Strength, ISO 4587:
Mild steel (grit blasted)
Hot Strength
Tested at temperature
% RT Strength
Temperature, °C
100
75
50
25
0
0 60 80 100 120
Documentation Provided By HMC Electronics
33 Springdale Ave. Canton, MA 02021
http://www.hmcelectronics.com
(800) 482-4440