Cirrus Logic CS4349 - Manual (Page 38)

38 DS782F2
CS4349
11 PACKAGE DIMENSIONS
1. D” and “E1” are reference datums and do not include mold flash or protrusions, but do include mold
mismatch and are measured at the parting line, mold flash or protrusions shall not exceed 0.20 mm per
side.
2. Dimension “b” does not include dambar protrusion/intrusion. Allowable dambar protrusion shall be
0.13 mm total in excess of “b” dimension at maximum material condition. Dambar intrusion shall not re-
duce dimension “b” by more than 0.07 mm at least material condition.
3. These dimensions apply to the flat section of the lead between 0.10 and 0.25 mm from lead tips.
12 THERMAL CHARACTERISTICS
Table 17. Thermal Characteristics
INCHES MILLIMETERS NOTE
DIM MIN NOM MAX MIN NOM MAX
A -- -- 0.043 -- -- 1.10
A1 0.002 0.004 0.006 0.05 -- 0.15
A2 0.03346 0.0354 0.037 0.85 0.90 0.95
b 0.00748 0.0096 0.012 0.19 0.245 0.30 2 , 3
D 0.303 0.307 0.311 7.70 7.80 7.90 1
E 0.248 0.2519 0.256 6.30 6.40 6.50
E1 0.169 0.1732 0.177 4.30 4.40 4.50 1
e -- 0.026 BSC -- -- 0.65 BSC --
L 0.020 0.024 0.028 0.50 0.60 0.70
µ 0° 4° 8° 0° 4° 8°
JEDEC #: MO-153
Controlling Dimension is Millimeters.
Parameters Symbol Min Typ Max Units
Package Thermal Resistance Single-Layer PCB
Multi-Layer PCB

JA
-
70
105
- °C/Watt
24L TSSOP (4.4 mm BODY) PACKAGE DRAWING
E
N
1 2 3
e b 2
A1
A2 A
D
SEATING
PLANE
E1 1
L
SIDE VIEW
END VIEW
TOP VIEW
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