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Figure 8-2: typical solder reflow profile, Table 8-1: typical solder processing parameters – PNI SENtral User Manual

Page 39

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PNI Sensor Corporation

Doc #1018049 R03

SENtral Technical Data Sheet

Page 38

Figure 8-2: Typical Solder Reflow Profile

Table 8-1: Typical Solder Processing Parameters

Parameter

Value

Ramp Up Rate

3°C/second

Preheat Temperature Range

150°C to 180°C

Preheat Time

60

– 180 seconds

Liquidus Temperature

220°C

Time above Liquidus

30

– 90 seconds

Peak Temperature

255°C ±5°C

Time within 5°C of Peak Temperature

10

– 20 seconds

Ramp Down Rate

6°C/second maximum

PB