Figure 8-2: typical solder reflow profile, Table 8-1: typical solder processing parameters – PNI SENtral User Manual
Page 39
PNI Sensor Corporation
Doc #1018049 R03
SENtral Technical Data Sheet
Page 38
Figure 8-2: Typical Solder Reflow Profile
Table 8-1: Typical Solder Processing Parameters
Parameter
Value
Ramp Up Rate
3°C/second
Preheat Temperature Range
150°C to 180°C
Preheat Time
60
– 180 seconds
Liquidus Temperature
220°C
Time above Liquidus
30
– 90 seconds
Peak Temperature
255°C ±5°C
Time within 5°C of Peak Temperature
10
– 20 seconds
Ramp Down Rate
6°C/second maximum
PB