PNI SENtral - Manual (Page 38)

PNI Sensor Corporation Doc #1018049 R03
SENtral Technical Data Sheet Page 37
Figure 8-1 provides design parameters for a typical SENtral solder mask and pad pattern.
Figure 8-1: Typical Solder Mask and Land Pad Parameters
A typical recommended solder reflow profile is given in Figure 8-2 and the associated processing
parameters are given in Table 8-1, both on the following page. Oven type and tolerances,
thermocouple tolerance, solder type, and the temperature difference across the board will affect
the actual implemented profile.