Micromod RetroPAK: SLC Installation Manual - Manual (Page 3)

SLC RetroPAK Controller
CONTENTS
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CONTENTS
Page
SECTION 1 - PRODUCT DESCRIPTION
1.1
OVERVIEW........................................................................................................................... 1
1.1.1 Features............................................................................................................................. 1
1.1.2 Related Documents ........................................................................................................... 4
1.2
EXPLANATION OF CATALOG NUMBERS ......................................................................... 5
1.2.1 General .............................................................................................................................. 5
1.2.2 Electrical Codes................................................................................................................. 5
1.3
BASIC HARDWARE ............................................................................................................. 6
1.3.1 RetroPAK CONTROLLER ................................................................................................. 6
1.3.2 1800P MOD 30ML Identity Module ................................................................................... 7
1.3.3
1800F Housing and Termination Assembly ...................................................................... 7
1.3.4 2010P Memory Module ..................................................................................................... 8
1.3.5 Downloading Cable ........................................................................................................... 8
1.4
I/O MODULES....................................................................................................................... 9
1.4.1 2012A Current Input Module (with 2-wire transmitter power)............................................ 9
1.4.2 2004A Solid-State Relay Input Module ............................................................................. 9
1.4.3 2005A Solid-State Relay Output Module........................................................................... 10
1.5
COMMUNICATIONS MODULES.......................................................................................... 10
1.5.1 2030N ICN Communication Module .................................................................................. 10
1.5.2 2030F
ICN Terminator ....................................................................................................... 11
SECTION 2 - MECHANICAL INSTALLATION
2.1
GENERAL ............................................................................................................................. 13
2.1.1 Displays and Cleaning....................................................................................................... 13
2.1.2 Environmental Specifications ............................................................................................ 13
2.2
UNPACKING......................................................................................................................... 13
2.3 USING THE MEMORY MODULE......................................................................................... 14
2.3.1 Memory Module Installation Procedure............................................................................. 14
2.3.2 Switch Positions................................................................................................................. 15
2.4
MOUNTING........................................................................................................................... 19
SECTION 3 - POWER, GROUNDING, AND BUILT-IN I/O CONNECTIONS
3.1
GENERAL ............................................................................................................................. 21
3.2 CONNECTION GUIDELINES ............................................................................................... 21
3.3 POWER CONNECTIONS..................................................................................................... 24
3.4 GROUND CONNECTIONS .................................................................................................. 25
3.4.1 Chassis and Shield Grounds ............................................................................................. 25
3.4.2 Circuit Common Connections............................................................................................ 25
3.4.3 Electrical Noise .................................................................................................................. 25
3.4.4 Noise Prevention Measures .............................................................................................. 26
3.5
BUILT-IN PROCESS INPUT CONNECTIONS..................................................................... 27
3.5.1 Built-In Voltage, Millivolt and Thermocouple Inputs .......................................................... 28
3.5.2 Built-In RTD Input .............................................................................................................. 29
3.5.3 Built-In Current Input - 2-Wire Transmitter ........................................................................ 30
3.5.4 Built-In Current Input - Non 2-Wire Transmitter................................................................. 31
3.5.5 Built-In Resistance Input.................................................................................................... 32
3.6
BUILT-IN OUTPUT CONNECTIONS ................................................................................... 33