GE Industrial Solutions 12V Austin SuperLynx 16A - Manual (Page 19)

GE
Data Sheet
12V Austin SuperLynx TM 16A: Non-Isolated DC-DC Power Modules
10Vdc –14Vdc input; 0.75Vdc to 5.5Vdc output; 16A Output Current
May 7, 2013 ©2013 General Electric Company. All rights reserved. Page 19
Surface Mount Information
Pick and Place
The Austin SuperLynx TM 12V SMT modules use an open
frame construction and are designed for a fully automated
assembly process. The modules are fitted with a label
designed to provide a large surface area for pick and place
operations. The label meets all the requirements for surface
mount processing, as well as safety standards, and is able to
withstand reflow temperatures of up to 300
o C. The label
also carries product information such as product code, serial
number and the location of manufacture.
Figure 34. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by using
open frame construction. Even so, these modules have a
relatively large mass when compared to conventional SMT
components. Variables such as nozzle size, tip style,
vacuum pressure and placement speed should be
considered to optimize this process. The minimum
recommended nozzle diameter for reliable operation is
6mm. The maximum nozzle outer diameter, which will safely
fit within the allowable component spacing, is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be used
within the space available.
Reflow Soldering Information
The Austin SuperLynx TM 12V SMT power modules are large
mass, low thermal resistance devices and typically heat up
slower than other SMT components. It is recommended that
the customer review data sheets in order to customize the
solder reflow profile for each application board assembly.
The following instructions must be observed when soldering
these units. Failure to observe these instructions may result
in the failure of or cause damage to the modules, and can
adversely affect long-term reliability.
Typically, the eutectic solder melts at 183 o C, wets the land,
and subsequently wicks the device connection. Sufficient
time must be allowed to fuse the plating on the connection
to ensure a reliable solder joint. There are several types of
SMT reflow technologies currently used in the industry.
These surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For reliable
soldering the solder reflow profile should be established by
accurately measuring the modules pin temperatures.
Figure 35. Reflow Profile.
An example of a reflow profile (using 63/37 solder) for the
Austin SuperLynx
TM 12V SMT power module is :
• Pre-heating zone: room temperature to 183 o C (2.0 to
4.0 minutes maximum)
• Initial ramp rate < 2.5 o C per second
• Soaking Zone: 155 o C to 183 o C – 60 to 90 seconds
typical (2.0 minutes maximum)
• Reflow zone ramp rate:1.3 o C to 1.6 o C per second
• Reflow zone: 210 o C to 235 o C peak temperature – 30 to
60 seconds (90 seconds maximum