GE Industrial Solutions EQW006 Series - Manual (Page 18)

Data Sheet
July 27, 2011
EQW006 Series, Eight Brick Power Modules: DC-DC Converter
36 – 75Vdc Input; 12Vdc Output; 6A Output Current
LINEAGE POWER 18
Surface Mount Information (continued)
M
A
X
T
E
M
P
SOLDER (
C)
200
205
210
215
220
225
230
235
240
0 10 20 30 40 50 60
Figure 19. Time Limit Curve Above 205 o C for
Tin/Lead (Sn/Pb) process.
Lead Free Soldering
The –Z version of the EQW006 modules are lead-free
(Pb-free) and RoHS compliant and are both forward
and backward compatible in a Pb-free and a SnPb
soldering process. Failure to observe the instructions
below may result in the failure of or cause damage to
the modules and can adversely affect long-term
reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Fig. 20.
MSL Rating
The EQW006 modules have a MSL rating of 2.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of
 30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A).
The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Lineage Power Board
Mounted Power Modules: Soldering and Cleaning
Application Note (AN04-001).
Per J-STD-020 Rev. C
0
50
100
150
200
250
300
Reflow Time (Seconds)
R
efl
o
w
T
em
p
(°
C
)
He ating Zone
1°C/Second
Peak Temp 260°C
* Min. Time Above 235°C
15 Seconds
*Time Above 217°C
60 Seconds
Cooling
Zone
Figure 20. Recommended linear reflow profile
using Sn/Ag/Cu solder.
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes.
A maximum preheat rate of 3
C/s is suggested. The
wave preheat process should be such that the
temperature of the power module board is kept below
210
C. For Pb solder, the recommended pot
temperature is 260 C, while the Pb-free solder pot is
270 C max. Not all RoHS-compliant through-hole
products can be processed with paste-through-hole
Pb or Pb-free reflow process. If additional information
is needed, please consult with your Lineage Power
representative for more details.