Thermal considerations, Continued) – GE Industrial Solutions ESTW010A0A Series User Manual
Page 10

Data Sheet
November 29, 2011
ESTW010A0A Series Eighth-Brick Power Modules
36
–75Vdc Input; 5.0Vdc Output; 10A Output Current
LINEAGE
POWER
10
Thermal Considerations
(continued)
OU
TP
U
T
C
U
R
R
E
N
T
,
I
O
(
A
)
AMBIENT TEMEPERATURE, T
A
(
o
C
)
Figure 18. Output Current Derating for the Module
with Heatplate with Heatplate
and 0.50” Heatsink;
Airflow in the Transverse Direction from Vout(+) to
Vout(-); Vin =48V.
Heat Transfer via Conduction
The module can also be used in a sealed environment
with cooling via conduction from the
module’s top
surface through a gap pad material to a cold wall, as
shown in Figure 19. This capability is achieved by
insuring the top side component skyline profile
achieves no more than 1mm height difference
between the tallest and the shortest power train part
that benefits from contact with the gap pad material.
The output current derating versus cold wall
temperature, when using a gap pad such as Bergquist
GP2500S20, is shown in Figure 20.
Figure 19. Cold Wall Mounting
OU
TP
U
T
C
U
R
R
E
N
T
,
I
O
(
A
)
COLDPLATE TEMEPERATURE, T
C
(
o
C)
Figure 20. Derated Output Current versus Cold
Wall Temperature with local ambient temperature
around module at 85C; Vin=48V.