Data sheet, Feature descriptions (continued) – GE Industrial Solutions EBVW020A0B Barracuda Series User Manual
Page 10

GE
Data Sheet
EBVW020A0B Barracuda Series; DC-DC Converter Power Modules
36-75Vdc Input; 12.0Vdc, 20.0A, 240W Output
July 22, 2013
©2012 General Electric Company. All rights reserved.
Page 10
Feature Descriptions (continued)
The thermal data presented here is based on physical
measurements taken in a wind tunnel, using automated 
thermo-couple instrumentation to monitor key component 
temperatures: FETs, diodes, control ICs, magnetic cores, 
ceramic capacitors, opto-isolators, and module pwb 
conductors, while controlling the ambient airflow rate and 
temperature. For a given airflow and ambient temperature, the 
module output power is increased, until one (or more) of the 
components reaches its maximum derated operating 
temperature, as defined in IPC-9592. This procedure is then 
repeated for a different airflow or ambient temperature until a 
family of module output derating curves is obtained. 
 
Heat-dissipating components are mounted on the top side of
the module. Heat is removed by conduction, convection and 
radiation to the surrounding environment. Proper cooling can 
be verified by measuring the thermal reference
temperature
(TH
x
). Peak temperature (TH
x
) occurs at the position indicated in
Figure 18 and 19. For reliable operation this temperature should 
not exceed the listed temperature threshold. 
Figure 18. Location of the thermal reference temperature 
TH
1
. Do not exceed 113 °C.
Figure 19. Location of the thermal reference temperature TH
2
for Base Plate module. Do not exceed 110 °C. 
The output power of the module should not exceed the rated 
power for the module as listed in the Ordering Information 
table. 
Although the maximum temperature of the power modules is 
TH
x
, you can limit this temperature to a lower value for
extremely high reliability. 
Please refer to the Application Note “Thermal Characterization 
Process For Open-Frame Board-Mounted Power Modules” for a 
detailed discussion of thermal aspects including maximum 
device temperatures. 
Heat Transfer via Convection
Increased airflow over the module enhances the heat transfer 
via convection. The thermal derating of figures 20 through 22 
show the maximum output current that can be delivered by 
each module in the indicated orientation without exceeding the 
maximum TH
x
temperature versus local ambient temperature
(T
A
) for air flows of, Natural Convection, 1 m/s (200 ft./min), 2
m/s (400 ft./min).
The use of Figures 20 is shown in the following example: 
Example 
What is the minimum airflow necessary for a EBVW020A0B 
operating at V
I
= 48 V, an output current of 14A, and a
maximum ambient temperature of 70 °C in transverse 
orientation. 
Solution: 
Given: V
in
= 48V, I
O
= 14A, T
A
= 70 °C
Determine required airflow (V) (Use Figure 20): 
V = 200LFM or greater. 
OUTP
U
T CU
RR
EN
T, I
O
(A
)
LOCAL AMBIENT TEMPERATURE, T
A
(C)
Figure 20. Output Current Derating for the Open Frame 
EBVW020A0B in the Transverse Orientation; Airflow 
Direction from Vin(-) to Vin(+); Vin = 48V. 
