GE Industrial Solutions ATL010A0X43-SR - Manual (Page 19)

Data Sheet
September 10, 2013 ATL010A0X43-SR Non Isolated Module 12Vdc, Programmable:
9 – 18Vdc input; 0.75Vdc to 5.5Vdc Output; 10A output current
LINEAGE POWER 19
Surface Mount Information
Pick and Place
The ATL010A0X43-SR modules use an open frame
construction and are designed for a fully automated
assembly process. The modules are fitted with a
label designed to provide a large surface area for pick
and place operations. The label meets all the
requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow
temperatures of up to 300
o C. The label also carries
product information such as product code, serial
number and the location of manufacture.
Figure 33. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended nozzle diameter for
reliable operation is 6mm. The maximum nozzle outer
diameter, which will safely fit within the allowable
component spacing, is 9 mm. Oblong or oval nozzles
up to 11 x 9 mm may also be used within the space
available.
Tin Lead Soldering
The ATL010A0X43-SR power modules are lead free
modules and can be soldered either in a lead-free
solder process or in a conventional Tin/Lead (Sn/Pb)
process. It is recommended that the customer review
data sheets in order to customize the solder reflow
profile for each application board assembly. The
following instructions must be observed when
soldering these units. Failure to observe these
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.
In a conventional Tin/Lead (Sn/Pb) solder process
peak reflow temperatures are limited to less than
235
o C. Typically, the eutectic solder melts at 183 o C,
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For
reliable soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
R
E
FL
O
W
TE
M
P
(°
C)
0
50
100
150
200
250
300
Preheat zo ne
max 4
o Cs -1
Soak zo ne
30-240s
Heat zone
max 4
o Cs -1
Peak Temp 235 o C
Co oling
zone
1-4
o Cs -1
T
lim
above
205 o C
REFLOW TIME (S)
Figure 34. Reflow Profile for Tin/Lead (Sn/Pb)
process.
MAX
TE
M
P
S
O
LD
ER
(°
C)
200
205
210
215
220
225
230
235
240
0 10 20 30 40 50 60
Figure 35. Time Limit Curve Above 205 o C for
Tin/Lead (Sn/Pb) process.