Intel SE8500HW4 - Manual (Page 18)

Processor and Chipset Intel® Server Board Set SE8500HW4
Revision 1.0
Intel order number D22893-001
6
The 64-bit Intel ® Xeon™ Processors MP includes the following advanced features:
ƒ Intel
®
Extended Memory 64 Technology (EM64T) for executing both 32-bit and 64-bit
applications simultaneously
ƒ Intel
®
Hyper-Threading (HT) technology providing two logical processors
ƒ Intel ® Demand-Based Switching (DBS) for power savings
ƒ Execute-Disable Bit for hardware support of security features
ƒ Quad-channel DDR2 400MHz memory support
ƒ PCI Express for faster serial interconnects
ƒ Streaming Single Instruction, Multiple Data (SIMD) Extensions 2 and 3 (SSE2, SSE3)
For more information, please refer to the 64-bit Intel
®
Xeon™ Processors MP with 1MB L2
cache Datasheet, 64-bit Intel ® Xeon™ Processors MP with up to 8MB L3 cache Datasheet, 64-
bit Intel ® Xeon™ Processors MP with 1MB L2 cache Specification Update, and 64-bit Intel ®
Xeon™ Processors MP with up to 8MB L3 cache Specification Update.
2.1.1 Heat Sink
The Intel
®
Server Board Set SE8500HW4 uses the reference design Common Enabling Kit
(CEK) heatsinks, which meet the 64-bit Intel ® Xeon™ Processors MP thermal performance
targets. Each CEK heatsink consists of the following components:
ƒ Passive heatsink (with captive standoff and screws)
ƒ Thermal Interface Material (TIM-2) – to cover the entire processor Integrated Heat
Spreader (IHS) and the heatsink base
ƒ Hat spring – mounted below the Intel
®
Server Board Set SE8500HW4 Mainboard