Avago Technologies ACPL-224-500E - Manual (Page 16)

AV02-4387EN 14 Avago Technologies
250
200
100
180 °C
2.5 °C±0.5°C/sec.
3 °C+1°C/-0.5°C
Peak Temperature
245 °C Peak Temperature
240 °C
Peak Temperature
230 °C
Soldering Time
200 °C
200 °C
30 sec
Pre Heating Rate: 3 °C+1°C/-0.5°C/sec.
Reflow Heating Rate: 2.5 °C±0.5°C/sec.
150 °C
140 °C
Room
Temperature
0
0 50 100 150 200 250
TEMPERATURE (
°C)
TIME (seconds)
30 sec
50 sec
TIGHT
TYPICAL
LOOSE
Pre Heating Time
150 °C, 90±30 sec.
GND BUS
V BUS
CC
OUTPUT
10 mm MAX
0.1µF
HCPL-2601/11 HCPL-2601/11
V
CC 1
2
3
4
8
7
6
5
V E
V
OUT
GND
ANODE
CATHODE
Avago optocouplers are suitable
for automatic printed circuit board
(PCB) assembly operations including
surface mount assembly. The follow-
ing guidelines are recommended for
proper opera tion and long term reli-
ability of Avago optocouplers.
Solder Reflow Process: Only one sol-
dering operation is recom mended
within the thermal profile shown
in Figure 16. With infrared lamp
heating, use precautions to avoid
localized temperature rise in the
resin. Also, the resin should not be
immersed in the solder. To prevent
chloride corrosion of the lead frame,
halide fluxes should not be used.
Wave Soldering: The maximum
solder temperature allowed is 260°C
for 10 seconds, with the solder 1.6
mm below the seating plane.
electrical disturbances. It is therefore
necessary to have proper shield-
ing and bypassing of the V
CC
and
Ground traces. Bypassing closely
to each of the optocouplers V
CC
-to-
Ground pins with low-inductance
ceramic capacitor is recommended
as shown in Figure 17.
Figure 17 shows an optional PCB
layout for a high speed digital op-
tocoupler for improving electrical
noise immunity. The optional V
CC
and Ground traces between the pin
rows of the optocoupler help shield
the output circuitry from electrical
disturbances on the input pins, thus
improving common-mode rejection.
Solvent Cleaning: The solvent tem-
perature and immersion time should
not exceed 45°C and three minutes
respectively. For ultra sonic cleaning,
environmentally safe solvents such
as ethyl and methyl alcohol are rec-
ommended.
ESD Precautions: Standard electro-
static discharge precau tions should
be taken in handling and assem-
bly of the optocouplers to prevent
damage or degradation of the
device.
Printed Circuit Board Layout: An op-
tocoupler performs reliably only in
a correctly designed circuit. In most
digital optocoup lers the amplifier
at the output is required to operate
with the very low photocurrent from
the photodetector. Consequently
these ampli fiers can be sensitive to
Figure 16. Temperature/Time Thermal Profile.
Figure 17. Optional Printed Circuit Board Layout for Improved Electrical Noise Immunity.
Guidelines for Printed Circuit Board Assembly and Layout