Emerson ROC827 - Manual (Page 71)

ROC827 Instruction Manual
Issued Mar-06 Input/Output Modules 4-1
Chapter 4 – Input/Output Modules
This chapter describes the Input/Output (I/O) modules used with the
ROC827 and expandable backplanes and contains information on
installing, wiring, and removing the I/O modules.
In This Chapter
4.1 I/O Module Overview ...............................................................................4-1
4.2 Installation................................................................................................4-3
4.2.1 Installing an I/O Module .................................................................4-4
4.2.2 Removing an I/O Module ...............................................................4-5
4.2.3 Wiring I/O Modules ........................................................................4-6
4.3 Analog Input Modules ..............................................................................4-6
4.4 Analog Output Modules ...........................................................................4-8
4.5 Discrete Input Modules ............................................................................4-9
4.6 Discrete Output Modules .......................................................................4-10
4.7 Discrete Output Relay Modules.............................................................4-11
4.8 Pulse Input Modules ..............................................................................4-12
4.9 RTD Input Modules................................................................................4-14
4.9.1 Connecting the RTD Wiring .........................................................4-15
4.10 J and K Type Thermocouple Input Modules..........................................4-16
4.11 Related
Specification Sheets.................................................................4-21
4.1 I/O Module Overview
The I/O modules typically consist of a terminal block for field wiring and
connectors to the backplane. The ROC827 base unit supports up to three
I/O modules. Each expandable backplane (EXP) can accommodate up to
six I/O modules, and a fully configured ROC827 can handle up to 27 I/O
modules (three on the base unit and six modules on each of up to four
expandable backplanes). Each I/O module electrically connects to field
wiring by a removable terminal block. Refer to Figures 4-1 and 4-2.
Note
: Figure 4-2 represents a ROC827 with one EXP.