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Thermal analysis, Thermal analysis –4 – Altera PowerPlay Early Power Estimator for Altera CPLDs User Manual

Page 14

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2–4

Chapter 2: PowerPlay Early Power Estimator Worksheets

Power Estimation Using the PowerPlay Early Power Estimator

PowerPlay Early Power Estimator for Altera CPLDs User Guide

December 2010

Altera Corporation

Thermal Analysis

To determine the junction temperature (T

J

) of the device in °C, the ambient

temperature and airflow are taken into consideration by the PowerPlay EPE
spreadsheet.

The device is considered a heat source and the junction temperature is the
temperature at the device. The thermal resistance of the path is referred to as the
junction-to-ambient thermal resistance (

JA

).

Figure 2–2

shows the thermal model for

the PowerPlay EPE spreadsheet.

The PowerPlay EPE spreadsheet determines the 

JA

based on the device, package, and

airflow selected in the input parameters section.

The PowerPlay EPE spreadsheet calculates the total power based on the device
properties which provide 

JA

and the ambient and junction temperature, as shown in

Equation 2–1

.

Table 2–3

lists the thermal analysis parameters in the PowerPlay EPE spreadsheet, as

shown in

Figure 2–1 on page 2–1

.

Figure 2–2. PowerPlay Early Power Estimator Thermal Model

Equation 2–1.

Power (P)

T

J

T

A

q

JA

Heat Source

P

T

J

T

A

JA

------------------

=

Table 2–3. Thermal Analysis Section Information

Column Heading

Description

Junction Temp, T

J

(°C)

Represents the device junction temperature estimation based on the supplied thermal
parameters.

JA

Junction-Ambient

Represents the junction-to-ambient thermal resistance between the device and the ambient air
(in °C/W).

Maximum Allowed T

A

(°C)

Represents a guideline for the maximum ambient temperature (in °C) that you can subject the
device to without violating the maximum junction temperature, based on the supplied cooling
solution and device temperature grade.