Chapter 1, About this manual, Purpose of this manual references – ADLINK CoreModule 430 User Manual
Page 7: Chapter 1 about this manual, Purpose of this manual, References
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CoreModule 430
Reference Manual
1
Chapter 1
About This Manual
Purpose of this Manual
Information provided in this reference manual includes:
•
Environmental requirements
•
Major chips and features implemented
•
CoreModule 430 SBC connector/pin numbers and definitions
•
BIOS Setup information
Information not provided in this reference manual includes:
•
Detailed chip specifications
•
Internal component operation
•
Standard interface pin-out tables
•
Internal registers or signal operations
•
Bus or signal timing for industry standard busses and signals
References
The following list of references may be helpful for you to complete your custom design successfully. Some
of these references are also available on the Ampro By ADLINK web page. The web page was created for
embedded system developers to share ADLINK’s knowledge, insight, and expertise.
Specifications
•
PC/104 Specifications Revision 2.5, November 2003
For latest revision of the PC/104 specifications, contact the PC/104 Consortium, at:
Web site:
http://www.pc104.org
Major Integrated Circuit (Chip) Specifications
The following chip specifications are used in the CoreModule 430 processor module:
•
DMP Electronics Inc. and the Vortex 86SX/DX CPU
Web site:
http://www.vortex86sx.com/
•
Winbond Electronics and the W25Q16BV SPI Flash memory
Web site:
http://www.winbond.com/hq/enu/ProductAndSales/ProductSearch/?partno=w25q16bv
•
Samsung Electronics and DDR2 on-board System Memory
Web site:
http://www.samsung.com/global/business/semiconductor/
•
Hynix Semiconductor, Inc. and DDR2 on-board Video Memory
Web site:
http://www.hynix.com/gl/products/consumer/consumer_info.jsp
NOTE
If you are unable to locate the datasheets using the links provided, search the
internet to find the manufacturer’s web site and locate the documents you need.