Kontron SMARC Evaluation Carrier - Manual (Page 28)

User’s Guide
28 www.kontron.com
6 Connectors – Standard Mezzanines, Slots and Sockets
Connector part number information is given in a table in Section 27 Appendix A: Connector Mating Part Number
Information.
6.1 mSATA Site
The SMARC Evaluation Carrier implements a SATA port in the JEDEC MO-300 (mSATA) form factor at site J71. This form
factor uses the same connector as mini-PCIe, but the electrical connections are different. Mini-PCIe cards will not be
functional in site J71. If a mini-PCIe card is accidentally inserted, the chance of damage is remote but possible.
6.2 miniPCIe Connectors
Two miniPCIe sites are implemented on the SMARC Evaluation Carrier. The two sites use industry standard miniPCIe
connector implementations, as defined in PCI Express Mini Card Electromechanical Specification. The Evaluation Carrier
design allows full size or half-size miniPCIe configurations to be built.
Site J72 is referred to as the “miniPCIe A” site because it ties to SMARC Module PCIE_A. This site is typically built in
the half-size card configuration.
Site J44 is the “miniPCIe B” site, fed by SMARC Module PCIE_B. This site is typically built in the full-size card
configuration.
Both of the Evaluation Carrier miniPCIe sites have a USB connection as well as a PCIe connection. The USB interfaces
are to the Evaluation Carrier 7 port USB hub chip.
The two miniPCIe sites share a connection to a microSIM card slot.
6.3 PCIe x 1 Slot
An industry standard PCIe x1 slot is implemented on the SMARC Evaluation Carrier. It is connected to the SMARC
PCIE_C port.
All SMARC Modules are expected to provide at least one PCIe port (Port A). Some will support two ports (A and B).
Relatively few Modules support a 3 rd port, so the SMARC PCIe x1 slot may be of limited use.
6.4 SPI Socket
The Evaluation Carrier has a “coffin style” zero insertion force socket for 8 pin SPI devices. The socket is Lotes ACA-SPI-
004-T01, for SPI devices with a 5.4mm x 5.4mm body size, 1.27mm lead pitch and 8.2mm overall lead span.
The SPI device is powered by V_IO on the Evaluation Carrier. The V_IO voltage is usually 1.8V, determined by the
Module.
A suitable SPI device for 1.8V I/O operation is the Winbond W25Q64DWSSIG (64 Mbits). Another one is Winbond
W25Q16DWSSIG (16 Mbits).