HMC Electronics Transplex Series Mini Compressed CleanFoam ESD Swab - Manual (Page 2)

I T W T E X W I P E D A T A T A B L E
Physical Characteristics
Head material 100 ppi open-cell CleanFoam ®
Head width 3.5 mm (0.138")
Head thickness 3.5 mm (0.138")
Head length 10.0 mm (0.394")
Handle material Transplex ®
Handle width 3.0 mm (0.118")
Handle thickness 3.0 mm (0.118")
Handle length 79.0 mm (3.110")
Total swab length 89.0 mm (3.504")
Head bond Thermal
Handle color Translucent
Design notes Precision pointed tip; compact handle
Contamination Characteristics
Property Measurement Test Method*
Nonvolatile residue
IPA extractant 0.07 mg/swab TM10: Procedure for Determining the Nonvolatile Residue (NVR) Extractable
from Swabs in a Given Solvent
Ions The Determination of Ions by Ion Chromatography (IC)
Chloride 0.06 µg/swab
Sulfate 0.18 µg/swab
Nitrate <0.01 µg/swab
Phosphate 0.36 µg/swab
Fluoride <0.01 µg/swab
Potassium 0.03 µg/swab
Calcium <0.01 µg/swab
Sodium 1.12 µg/swab
Magnesium <0.01 µg/swab
Electrostatic Discharge Characteristics
Property Measurement Test Method
Handle resistivity 10 x 10 9 ohms/cm TM16: Determination of the Resistance per Unit Length (ohm/cm) of Swab
Handles. (Adapted from EOS/ESD-S11.11-1993.)
*Test procedures available upon request.
Mini Compressed CleanFoam ® ESD Swab
TX750E TX750D
Documentation Provided By HMC Electronics
33 Springdale Ave. Canton, MA 02021
http://www.hmcelectronics.com
(800) 482-4440