Package dimensions, Tssop thermal characteristics, Cs8421 – Cirrus Logic CS8421 User Manual
Page 33: 20l tssop (4.4 mm body) package drawing
DS641F6
33
CS8421
CS8421
6. PACKAGE DIMENSIONS
Notes:
1.
“D” and “E1” are reference datums and do not included mold flash or protrusions, but do include mold mismatch
and are measured at the parting line, mold flash or protrusions shall not exceed 0.20 mm per side.
2.
Dimension “b” does not include dambar protrusion/intrusion. Allowable dambar protrusion shall be 0.13 mm total in
excess of “b” dimension at maximum material condition. Dambar intrusion shall not reduce dimension “b” by more
than 0.07 mm at least material condition.
3.
These dimensions apply to the flat section of the lead between 0.10 and 0.25 mm from lead tips.
TSSOP THERMAL CHARACTERISTICS
INCHES
MILLIMETERS
NOTE
DIM
MIN
NOM
MAX
MIN
NOM
MAX
A
--
--
0.043
--
--
1.10
A1
0.002
0.004
0.006
0.05
--
0.15
A2
0.03346
0.0354
0.037
0.85
0.90
0.95
b
0.00748
0.0096
0.012
0.19
0.245
0.30
2,3
D
0.252
0.256
0.259
6.40
6.50
6.60
1
E
0.248
0.2519
0.256
6.30
6.40
6.50
E1
0.169
0.1732
0.177
4.30
4.40
4.50
1
e
--
--
0.026
--
--
0.65
L
0.020
0.024
0.028
0.50
0.60
0.70
µ
0°
4°
8°
0°
4°
8°
JEDEC #: MO-153
Controlling Dimension is Millimeters.
Parameter
Symbol
Min
Typ
Max
Units
Junction to Ambient Thermal Impedance
2 Layer Board
4 Layer Board
JA
-
-
48
38
-
-
°C/Watt
°C/Watt
20L TSSOP (4.4 MM BODY) PACKAGE DRAWING
E
N
1 2 3
e
b
2
A1
A2
A
D
SEATING
PLANE
E1
1
L
SIDE VIEW
END VIEW
TOP VIEW