AMD SEMPRON 10 - Manual (Page 55)

Chapter 9 Mechanical Data 43
31994A —1 August 2004 AMD Sempron™ Processor Model 10 with 256K L2 Cache Data Sheet
9 Mechanical Data
Th e A M D S e m p ro n ™ p ro c e s s o r m o d e l 1 0 c o n n e c t s t o
themotherboard through a Pin Grid Array (PGA) socket named
Socket A. This processor utilizes the Organic Pin Grid Array
(OPGA) package type described in this chapter. For more
information, see the AMD Athlon™ Processor-Based Motherboard
Design Guide, order# 24363.
9.1 Die Loading
The processor die on the OPGA package is exposed at the top of
the package. This feature facilitates heat transfer from the die
to an approved heat sink. Any heat sink design should avoid
loads on corners and edges of die. The OPGA package has
compliant pads that serve to bring surfaces in planar contact.
Tool-assisted zero insertion force sockets should be designed so
that no load is placed on the ceramic substrate of the package.
Table 16 shows the mechanical loading specifications for the
processor die. It is critical that the mechanical loading of the
heat sink does not exceed the limits shown in Table 16.
Table 16. Mechanical Loading
Location Dynamic (MAX) Static (MAX) Units Note
Die Surface 100 30 lbf 1
Die Edge 10 10 lbf 2
Notes:
1. Load specified for coplanar contact to die surface.
2. Load defined for a surface at no more than a two-degree angle of inclination to die surface.