AMD SEMPRON 10 - Manual (Page 48)

36 Electrical Data Chapter 7
AMD Sempron™ Processor Model 10 with 256K L2 Cache Data Sheet 31994A —1 August 2004
Thermal Protection
Characterization The following section describes parameters relating to thermal
protection. The implementation of thermal control circuitry to
control processor temperature is left to the manufacturer to
determine how to implement.
Thermal limits in motherboard design are necessary to protect
the processor from thermal damage. T
S H U T D OW N
is the
temperature for thermal protection circuitry to initiate
shutdown of the processor. T
SD_DELAY
is the maximum time
allowed from the detection of the over-temperature condition to
processor shutdown to preve nt t h erm al d a mag e to t he
processor.
Systems that do not implement thermal protection circuitry or
that do not react within the time specified by T
SD_DELAY
can
cause thermal damage to the processor during the unlikely
events of fan failure or powering up the processor without a
heat-sink. The processor relies on thermal circuitry on the
motherboard to turn off the regulated core voltage to the
processor in response to a thermal shutdown event.
Thermal protection circuitry reference designs and thermal
solution guidelines are found in the following documents:
AMD Athlon™ Processor-Based Motherboard Design Guide, order#
24363
AMD Thermal, Mechanical, and Chassis Cooling Design Guide,
order# 23794
See http://www.amd.com for more information about thermal
solutions.