IEI Integration PCIE-Q350 v1.20 - Manual (Page 62)

PCIE-Q350 PICMG 1.3 CPU Card
Page 41
A cooling fan and heat sink must be installed on the CPU. Thermal paste must be
smeared on the lower side of the heat sink before it is mounted on the CPU. Heat sinks
are also mounted on the Northbridge and Southbridge chipsets to ensure the operating
temperature of these chips remain low.
2.10.3 Power Consumption
Table 2-3 shows the power consumption parameters for the PCIE-Q350 running 3D
Mark® 2001 SE330 with a 2.66 GHz E6700 Intel® Core™2 Duo processor with a 1066
MHz FSB and four 2.0GB 667MHz DDR2 DIMMs.
Voltage Current
+3.3V 3.0A
+5.0V 5.1A
+12V 4.23A
5Vsb 0.28A
Table 2-3: Power Consumption
2.11 Expansion Options
2.11.1 Expansion Options Overview
A number of compatible IEI Technology Corp. PICMG 1.3 backplanes and chassis can be
used to develop and expanded system. These backplanes and chassis are listed below.
2.11.2 IEI Expansion PICMG 1.3 Backplanes
The backplanes listed in Table 2-4 are compatible with the PCIE-Q350 and can be used
to develop highly integrated industrial applications. All of the backplanes listed below have
24-pin ATX connector and a 4-pin ATX connector. For more information about these
backplanes please consult the IEI catalog or contact your vendor, reseller or the IEI sales
team at [email protected].