GE Industrial Solutions Austin Microlynx SIP - Manual (Page 16)

Data Sheet
July 2, 2010 Austin MicroLynx TM SIP Non-isolated Power Modules:
3 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 5A output current
LINEAGE POWER 16
Post solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect both
the reliability of a power module and the testability of the
finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures,
refer to Board Mounted Power Modules: Soldering and
Cleaning
Application Note.
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the SAC
(Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes. A
maximum preheat rate of 3
°C/s is suggested. The wave
preheat process should be such that the temperature of
the power module board is kept below 210
°C. For Pb
solder, the recommended pot temperature is 260 °C, while
the Pb-free solder pot is 270 °C max. Not all RoHS-
compliant through-hole products can be processed with
paste-through-hole Pb or Pb-free reflow process. If
additional information is needed, please consult with your
Lineage Power technical representative for more details.