GE Industrial Solutions EHHD036A0F HAMMERHEAD Series - Manual (Page 12)

GE
Datasheet
EHHD036A0F Series: DC-DC Converter Power Module
18 to 75V
dc
Input; 3.3V
dc
, 36A, 120W Output
February 28, 2014 ©2014 General Electric Corporation. All rights reserved. Page 12
RE
FLOW T
EMP
(°
C)
REFLOW TIME (S)
Figure 24. Reflow Profile for Tin/Lead (Sn/Pb) process.
MAX T
EMP
SO
LDE
R (
°C)
Figure 25. Time Limit Curve Above 205 o C for Tin/Lead
(Sn/Pb) process
Pb-free Reflow Profile
Power Systems will comply with J-STD-015 Rev. D
(Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices) for both Pb-free solder
profiles and MSL classification procedures. This standard
provides a recommended forced-air-convection reflow
profile based on the volume and thickness of the package
(table 4-2). The suggested Pb-free solder paste is Sn/Ag/Cu
(SAC). The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Figure 26.
Figure 26. Recommended linear reflow profile using
Sn/Ag/Cu solder.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The result
of inadequate cleaning and drying can affect both the
reliability of a power module and the testability of the
finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures, refer
to GE Board
Mounted Power Modules: Soldering and Cleaning Application
Note (AN04-001).
0
50
100
150
200
250
300
P reheat zo ne
max 4
o Cs -1
Soak zone
30-240s
Heat zo ne
max 4
o Cs -1
P eak Temp 235 o C
Co oling
zone
1-4
o Cs -1
T
lim
above
205 o C
200
205
210
215
220
225
230
235
240
0 10 20 30 40 50 60
Per J-STD-020 Rev. D
0
50
100
150
200
250
300
Reflow Time (Seconds)
Reflow Temp (°C)
Heating Zone
1°C/Second
Peak Temp 260°C
* Min. Time Above 235°C
15 Seconds
*Time Above 217°C
60 Seconds
Cooling
Zone