High density dc-dc modules – Powersolve TEP100 Series User Manual
Page 2
Powersolve Electronics Ltd. 8A Arnhem Road, Newbury, RG14 5RU. England
Tel: 01635 521858 Fax: 01635 523771 Email: [email protected]
www.powersolve.co.uk
High Density DC-DC Modules
Mechanical and Connection Details
Pin
Function
1
-Vin (GND)
2
Case
3
Remote On/Off
4
+Vin (Vcc)
5
-Vout
6
-Sense *
7
Trim
8
+Sense *
9
+Vout
* Sense pins must be connected
at either the load or module
TEP100 Module
Order Code: TEP-HS1 (shown with heatsink mounted)
Pin Diameters
Pin 5 & 9: 0.08 (2.0)
Other pins: 0.04 (1.0)
Suffix -CM: Chassis Mount Adaptor
Suffix -CMF: Chassis Mount Adaptor with EMI Filter
Dimensions in Inches (mm)
Tolerances: ±0.02 (±0.5)
Pin Pitch Tolerances: ±0.01 (±0.25)
Mounting Hole Pitch Tolerances: ±0.01 (±0.25)
NOTE:
Heatsinks supplied as separate items
Adaptors are supplied factory fitted to module and can not be
supplied as a separate item
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