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High density dc-dc modules – Powersolve TEP100 Series User Manual

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Powersolve Electronics Ltd. 8A Arnhem Road, Newbury, RG14 5RU. England

Tel: 01635 521858 Fax: 01635 523771 Email: [email protected]

www.powersolve.co.uk

High Density DC-DC Modules

Mechanical and Connection Details

Pin

Function

1

-Vin (GND)

2

Case

3

Remote On/Off

4

+Vin (Vcc)

5

-Vout

6

-Sense *

7

Trim

8

+Sense *

9

+Vout

* Sense pins must be connected
at either the load or module

TEP100 Module

Order Code: TEP-HS1 (shown with heatsink mounted)

Pin Diameters
Pin 5 & 9: 0.08 (2.0)
Other pins: 0.04 (1.0)

Suffix -CM: Chassis Mount Adaptor

Suffix -CMF: Chassis Mount Adaptor with EMI Filter

Dimensions in Inches (mm)
Tolerances: ±0.02 (±0.5)
Pin Pitch Tolerances: ±0.01 (±0.25)
Mounting Hole Pitch Tolerances: ±0.01 (±0.25)

NOTE:
Heatsinks supplied as separate items
Adaptors are supplied factory fitted to module and can not be
supplied as a separate item