Rainbow Electronics AT24C128 - Manual (Page 20)

20
AT24C128/256
0670H–SEEPR–07/02
14A2 – TSSOP
2325 Orchard Parkway
San Jose, CA 95131
TITLE DRAWING NO.
R
REV.
12/28/01
14A2,14-lead (4.4 x 5 mm Body), 0.65 Pitch,
Thin Shrink Small Outline Package (TSSOP)
14A2 A
L1
A
L
D
A2
E
E1
e
b
Top View
Side View
End View
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
Notes: 1. This drawing is for general information only. Please refer to JEDEC Drawing MO-153, Variation AB-1 for
additional information.
2. Dimension "D" does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate
burrs shall not exceed 0.15 mm (0.006 in) per side.
3. Dimension "E1" does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not
exceed 0.25 mm (0.010 in) per side.
4. Dimension "b" does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total
in excess of the "b" dimension at maximum material condition. Dambar cannot be located on the lower
radius of the foot. Minimum space between protrusion and adjacent lead is 0.07 mm.
5. Dimension "D" and "E1" to be determined at Datum Plane H.
D 4.90 5.00 5.10 2, 5
E 6.40 BSC
E1 4.30 4.40 4.50 3, 5
A 1.20
A2 0.80 1.00 1.05
b 0.19 0.30 4
e 0.65 BSC
L 0.45 0.60 0.75
L1 1.00 REF