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C-compatible rtc in a tdfn max6900, Package information (continued) – Rainbow Electronics MAX6900 User Manual

Page 17

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I

2

C-Compatible RTC in a TDFN

MAX6900

Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.

Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 17

© 2003 Maxim Integrated Products

Printed USA

is a registered trademark of Maxim Integrated Products.

DOCUMENT CONTROL NO.

APPROVAL

TITLE:

PROPRIETARY INFORMATION

REV.

2

2

COMMON DIMENSIONS

SYMBOL

MIN.

MAX.

A

0.70

0.80

D

2.90

3.10

E

2.90

3.10

A1

0.00

0.05

L

0.20

0.40

PKG. CODE

6

N

T633-1

1.50–0.10

D2

2.30–0.10

E2

0.95 BSC

e

MO229 / WEEA

JEDEC SPEC

0.40–0.05

b

1.90 REF

[(N/2)-1] x e

1.50–0.10

MO229 / WEEC

1.95 REF

0.30–0.05

0.65 BSC

2.30–0.10

T833-1

8

PACKAGE VARIATIONS

21-0137

0.25–0.05

2.00 REF

MO229 / WEED-3

0.50 BSC

1.50–0.10

2.30–0.10

10

T1033-1

0.25 MIN.

k

A2

0.20 REF.

D

SEMICONDUCTOR

DALLAS

PACKAGE OUTLINE, 6, 8 & 10L,

TDFN, EXPOSED PAD, 3x3x0.80 mm

Package Information (continued)

(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to

www.maxim-ic.com/packages

.)