Chip information, Package information, Pin configuration/ functional block diagram – Rainbow Electronics MAX19997A User Manual
Page 34: Process: sige bicmos
PACKAGE TYPE
PACKAGE CODE
DOCUMENT NO.
36 Thin QFN-EP
T3666+2
1
+
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
28
29
30
31
32
33
34
35
36
19
20
21
22
23
24
25
26
27
GND
V
CC
GND
GND
GND
GND
GND
GND
RFMAIN
RFDIV
EXPOSED
PAD
IFD_SET
GND
GND
LO_ADJ_D
GND
V
CC
V
CC
GND
LO_ADJ_M
V
CC
GND
GND
IFM_SET
IFD+
IFD-
V
CC
IFM+
IFM-
LO
GND
GND
GND
GND
GND
GND
V
CC
MAX19997A
EXPOSED PAD ON THE BOTTOM OF THE PACKAGE.
6mm x 6mm THIN QFN (EXPOSED PAD)
TOP VIEW
Chip Information
PROCESS: SiGe BiCMOS
Package Information
For the latest package outline information and land patterns, go
to
www.maxim-ic.com/packages
.
Pin Configuration/
Functional Block Diagram
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
34 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2008 Maxim Integrated Products
Maxim is a registered trademark of Maxim Integrated Products, Inc.
Dual, SiGe High-Linearity, 1800MHz to 2900MHz
Downconversion Mixer with LO Buffer
MAX19997A